Advanced Packaging Technology Development Substrates Module Engineer On-shift (nightshift)

Intel Intel · Semiconductors · Arizona, Phoenix, United States

Module Engineer On Shift (MEOS) provides real-time factory support for equipment, process, and product issues to ensure 24/7 manufacturing operations. Responsibilities include lot movement, responding to process excursions, recovering from equipment errors, lot disposition, new tool enablement, and operational activities. The role requires strong problem-solving, communication, and adaptability in a fast-paced manufacturing environment. Minimum qualifications include a Bachelor's degree in a related engineering or science field with 1+ years of experience, or a Master's degree with 0 years of experience, along with proficiency in statistical data analysis and quality systems. Preferred qualifications include experience with DOE, SPC, semiconductor manufacturing, and metrology tools.

What you'd actually do

  1. Provide real-time support for equipment, process, and product issues within the manufacturing environment.
  2. Execute non-standard procedures and perform inspections and imaging on substrate panels to collect development and process data.
  3. Write and update specifications, procedures, and Requests for Change (RFCs) as required.
  4. Communicate key issues and updates with tool owners, process owners, and cross-functional partners.
  5. Document and communicate all shift activities through detailed written and verbal pass-downs to the incoming shift team.

Skills

Required

  • Bachelor's degree in Materials Engineering, Mechanical Engineering, Chemical Engineering, Chemistry, Physics, or a related discipline, with 1+ years of relevant experience.
  • OR Master's degree in Materials Engineering, Mechanical Engineering, Chemical Engineering, Chemistry, Physics, or a related discipline with 0 years of relevant experience.
  • Proficiency in statistical data analysis, process characterization, and quality systems for manufacturing.

Nice to have

  • Experience with design of experiments (DOE) principles and statistical process control (SPC).
  • Knowledge of manufacturing process control and reliability testing
  • Experience in semiconductor manufacturing or packaging substrate development.
  • Familiarity with metrology tool recipe creation and troubleshooting.
  • Strong problem-solving abilities and the capability to collaborate effectively across teams.