Job Details:
Job Description:
Manufacturing Development Customer Engineering (MDCE) is Intel's newest organization within Intel Foundry Technology Manufacturing (FTM). We bridge the critical gap between Technology Development (TD) and High Volume Manufacturing (HVM), advancing technology nodes from initial product qualification to high-yield production across multiple products while enhancing technologies for our foundry customers. MDCE is also chartered to develop new technologies on mature node infrastructure to bring new solutions to new customers at reliable yield and performance and low cost, and this is where you are going to play a role. MDCE engineers in Ireland work within F34 at Leixlip, Ireland. F34 opened in 2023 and began high-volume production of Intel 4 technology. This milestone also represents the deployment by Intel of extreme ultraviolet lithography in high-volume manufacturing for the first time globally. Since 1989, Intel has invested more than 30 billion in Ireland creating the most advanced industrial campus in Europe, and Intel Ireland is home to Europe's most advanced high scale semi-conductor foundry fab.
Key Responsibilities:
- Leading engineering projects to execute high-volume manufacturing (HVM) yield roadmaps and achieve performance targets.
- Collaborating with Technology Development and Local Yield teams to implement new technologies in production fabs.
- Working with FEOL/BEOL Integration, Device, Defect Reduction, and Yield Analysis teams to identify root causes of yield and performance issues and executing mitigation plans within set timelines.
- Conducting feasibility studies and experiments to characterize processes and enhance product performance throughout development.
- Managing New Product Introductions (NPI) in production fabs and optimizing processes to meet foundry customer specifications.
- Partnering with Local Yield teams to improve product yield, quality, performance, and reduce wafer costs.
- Outstanding verbal and written communication skills with ability to effectively convey complex technical concepts to diverse audiences
- Demonstrated success in driving technical projects from conception to implementation
Qualifications:
**Minimum **Qualifications
- Bachelor's degree in a relevant science or engineering field, with at least 5 years of experience.
- Experience in advanced node semiconductor industry, specifically in FEOL Process Integration; level of experience will influence job grade.
- Proficient understanding of Device Physics, with experience in FinFET or Gate-All-Around technology development or high-volume manufacturing.
- Familiarity with module processes such as lithography, dry etch, wet etch, CMP, diffusion, implant, thin films, and metrology.
- Strong problem-solving skills, self-initiative, and ability to learn independently.
- Ability to collaborate effectively with multi-functional and multi-cultural teams.
- Excellent communication skills.
**Preferred **Qualifications
- Advanced degree (Master's or Ph.D.) in Electrical Engineering, Physics, or Materials Science; related fields may be considered based on industry experience.
- Experience in project/program management and/or as a TFT lead.
- Strong interpersonal skills, including the ability to influence and motivate others.
- Experience engaging with external foundry customers through technical interactions.
- Background in new semiconductor technology development.
- Experience in fabrication process engineering including: (lithography and advanced patterning, dry etch processes, wet cleaning technologies, diffusion processes, thin-film deposition, and chemical mechanical planarization (CMP)
- Semiconductor foundry experience
Why Join Intel MDCE? Intel offers an exceptional opportunity to work with cutting-edge technology in a collaborative and innovative environment. This position provides a unique platform to shape the future of Intel's semiconductor solutions while directly supporting the company's efforts to meet diverse industry needs and maintain leadership in high-volume manufacturing. Join us in driving the next generation of semiconductor manufacturing excellence and advancing Intel's position as a global technology leader.
Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Job Type:
Experienced Hire
Shift:
Shift 1 (Ireland)
Primary Location:
Ireland, Leixlip
Additional Locations:
Business group:
Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Position of Trust
N/A
Work Model for this Role
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.