Packaging Module Equipment Development Engineer

Intel Intel · Semiconductors · Arizona, Phoenix, United States

Develops assembly processes and equipment for Intel's future packaging platform technologies, optimizing manufacturing for quality, reliability, and yield. Utilizes AI/ML applications for metrology, processing image data from inspection systems to improve defect detection and minimize false positives. Collaborates with AI experts and automation teams.

What you'd actually do

  1. Develops assembly processes and/or equipment and applies innovative engineering concepts to support Intel’s future assembly packaging platform technologies.
  2. Optimizes manufacturing processes to improve quality, reliability, cost, yield, productivity, and manufacturability.
  3. Develops process and equipment specifications using Design of Experiments (DOE), Statistical Process Control (SPC), and data analysis methodologies to drive process optimization and continuous improvement.
  4. Documents technical findings, process improvements, and best practices through technical reports and white papers.
  5. Develops and maintains equipment used to evaluate silicon and package technologies under simulated field-use conditions, including heat, humidity, temperature cycling, and dynamic force environments.

Skills

Required

  • Bachelor's degree in Engineering, Physics, Chemistry, Materials Science, or a related technical field with 5+ years of engineering industry experience including inspection equipment
  • Operating, programming, troubleshooting, and optimizing automated inspection equipment
  • Utilizing software tools to process and analyze inspection images
  • Performing data analysis to identify patterns, understand input/output relationships, and continuously improve inspection system performance and process capability.

Nice to have

  • Master's degree in a related field with 3+ years of engineering industry experience
  • PhD in a related field with 6+ months of engineering industry experience
  • Experience with automated inspection tools, image processing algorithms and artificial intelligence.
  • Semiconductor fabrication processes and technology experience.
  • Advanced packaging and/or assembly process experience.
  • Experience with equipment selection, integration, ownership, and change control management systems.
  • Project management experience delivering results for complex, time-critical technical projects.
  • Strong technical problem-solving and innovation skills within manufacturing or engineering environments.

What the JD emphasized

  • AI/ML applications
  • automated inspection equipment
  • image processing algorithms
  • artificial intelligence