1st Shift Backside Process Support Engineer

RTX RTX · Aerospace · andover, MA +1 · Engineering

Process Support Engineer for backside semiconductor fabrication (gallium arsenide, gallium nitride, III-V focal plane arrays). Responsibilities include engineering support, training, dispositioning wafers, failure analysis, tool/process qualification, efficiency improvements, and communication with cross-functional teams in a cleanroom environment. Requires experience with semiconductor processing techniques and a security clearance.

What you'd actually do

  1. Processing wafers to create FETs, MMICs, and FPAs in a cleanroom environment.
  2. Work autonomously with limited oversight.
  3. Influence others regarding policies, practices, and procedures.
  4. Review and disposition wafers on hold for evaluation in the work center
  5. Work well in small, cross-functional teams, assist in maintaining or improving production processes.

Skills

Required

  • Degree in Science, Technology, Engineering or Mathematics (STEM)
  • 6 years of prior relevant experience, or an advanced degree in a related field and minimum 4 years’ experience with semiconductor processing techniques
  • Ability to obtain and maintain a US security clearance
  • U.S. citizenship

Nice to have

  • Degree in Science, Technology, Engineering, or Mathematics (STEM)
  • Clearly and succinctly document and present process development status in meetings
  • Knowledge related to semiconductor processing and data analysis
  • Experience utilizing data analysis software packages (e.g. MATLAB, Python, SQL, JMP)
  • Experience with quality standards and audits
  • Ability to present and communicate effectively across different functions

What the JD emphasized

  • U.S. citizenship is required
  • The ability to obtain and maintain a U.S. government issued security clearance is required
  • Active and existing security clearance required after day 1
  • A minimum of 6 years of prior relevant experience, or an advanced degree in a related field and minimum 4 years’ experience with semiconductor processing techniques such as photolithography, dry etching, metals evaporation, and optical or scanning electron microscope inspections