3d Ic and Advanced Packaging Cad Engineer

AMD AMD · Semiconductors · MARKHAM, Canada · Engineering

This role focuses on integrating AI and ML capabilities into CAD and EDA workflows for 3D-IC and advanced packaging design. The engineer will develop and deploy agentic AI systems, LLM-assisted automation, and ML-based optimizations to improve design quality of results (QoR) in areas like timing, area, and performance. The role requires a strong silicon hardware design background, software/scripting proficiency, and hands-on experience applying AI to CAD/EDA problems.

What you'd actually do

  1. Implement and maintain 3D-IC and advanced packaging design flows from RTL through signoff.
  2. Develop and integrate end-to-end AI capabilities into CAD flows — including ML-based optimization, predictive modeling, and LLM-assisted automation.
  3. Build and deploy agentic AI systems that automate multi-step design and verification tasks.
  4. Partner with EDA vendors (Synopsys, Cadence) on 3D-IC feature requirements, best practices, and AI co-development opportunities.
  5. Define strategy and key initiatives to ensure flows meet future design requirements and advanced technology nodes.

Skills

Required

  • Strong silicon hardware design background
  • software and scripting proficiency
  • hands-on experience applying machine learning to CAD or EDA workflows
  • Python
  • TCL
  • Perl
  • Linux/Unix environment
  • Verilog
  • RTL
  • UPF

Nice to have

  • Strong experience in 3D-IC design and advanced packaging technologies
  • Hands-on experience with Synopsys 3DIC Compiler and related EDA toolchains
  • Strong understanding of EDA tools from Synopsys and Cadence
  • Experience building or working with LLM-based tools, agentic AI frameworks, or AI-assisted automation pipelines
  • Familiarity with distributed and cloud compute environments for flow automation

What the JD emphasized

  • AI-driven capabilities
  • applying machine learning to CAD or EDA workflows
  • intersection of AI and CAD
  • applying ML models to improve QoR
  • building LLM-assisted flows
  • designing agentic systems
  • Demonstrated experience applying AI to CAD, EDA, or hardware design problems
  • Experience building or working with LLM-based tools, agentic AI frameworks, or AI-assisted automation pipelines

Other signals

  • AI-driven capabilities at every stage of the stack
  • applying ML models to improve QoR
  • building LLM-assisted flows
  • designing agentic systems that reduce manual iteration
  • Implement and maintain 3D-IC and advanced packaging design flows from RTL through signoff
  • Develop and integrate end-to-end AI capabilities into CAD flows
  • Build and deploy agentic AI systems that automate multi-step design and verification tasks