Advanced Packaging Flagship Curriculum Internship Program

Intel Intel · Semiconductors · Kulim, Malaysia

Internship in semiconductor advanced packaging, focusing on process improvements, materials characterization, experimental validation, and computational analysis. The role involves literature surveys, DOE, lab experiments, technical documentation, and supporting R&D aligned with Intel's business goals.

What you'd actually do

  1. Conduct literature surveys and technical assessments to inform process improvements and research efforts.
  2. Perform materials characterization and apply principles of Design of Experiments (DOE) to validate hypotheses and drive innovation.
  3. Develop and execute lab-scale experiments to advance understanding of process mechanics and improvements.
  4. Contribute to technical documentation for projects, ensuring clarity and accessibility of results and methodologies.
  5. Utilize computational tools, such as finite element analysis and computational fluid dynamics, to analyze and refine process designs.

Skills

Required

  • EBB302 Advanced Packaging Flagship Curriculum completion
  • Undergraduate student status
  • Literature surveys
  • Technical assessments
  • Materials characterization
  • Design of Experiments (DOE)
  • Lab-scale experiments
  • Technical documentation
  • Finite element analysis
  • Computational fluid dynamics