Advanced Packaging Supplier Technology Development Program Manager

Intel Intel · Semiconductors · Arizona, Phoenix, United States

The Advanced Packaging Substrate Integration Team is seeking a Program Manager to oversee on-time supplier capacity expansion for advanced heterogeneous packaging technology (EMIB-T). This role involves qualifying new process tools, supplier lines, and factories to meet foundry customer demand. Responsibilities include scoping, planning, CapEx project execution, capability transfer from internal lines to suppliers, and regular management updates. The position requires strong project management, technical risk assessment, problem-solving, and supplier/stakeholder management skills, with extensive interaction with supplier and internal teams, including international travel.

What you'd actually do

  1. Scoping / Planning - HVM process flow finalization and process tool requirements definition with the TD team and the supplier. Tool selection and production line qualification planning so as to minimize ramp risk and meet certification requirements. Existing and, as necessary, new factory planning / layout to maximize yield and new capacity in the minimum time within budget. Update plans as necessary or as contingencies for customer / technical / volume requirements changes.
  2. CapEx Project Execution through Production Ramp - on-time execution of management-aligned capacity expansion plans through systematic processes. Create and drive yield-enabling/yield-improvement plans. Drive qualification activities and closely monitor ramp indicators to insure incident-free production ramp of new capacity. Anticipate and quickly resolve technical and logistical problems that would risk quality or on-time delivery of committed capacity. Development and maintenance of supplier milestone progress dashboards to focus resources and keep projects on-track.
  3. Capability Transfer - Where necessary, facilitate technical capability transfer from internal pilot manufacturing line to supplier capacity expansion line. Assess supplier knowledge gaps relative to technical and schedule requirements to create and drive gap closure / risk mitigation plans.
  4. Regular updates to management / stakeholders on progress and risk mitigation activities.

Skills

Required

  • PhD in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Organic Chemistry, Polymer Engineering or relevant field and 3+ years of relevant experience OR Masters Degree in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Organic Chemistry, Polymer Engineering, or relevant field and 5+ years of relevant experience
  • Demonstrated experience achieving integrated process, materials, chemistry, and/or tool hardware development and customer qualification milestones on-time.
  • 2+ years’ experience with advanced semiconductor packaging / substrates.
  • Experience managing cross-functional teams across multiple time zones and cultural contexts.
  • Strong understanding of process building blocks (including component embedding, laser drilling, dielectric lamination, lithography, multi-metal electrolytic plating, defect inspection/metro, electrical test, etc.) and critical process interactions.
  • Strong knowledge of DOE, PCS, and SPC.

Nice to have

  • Experience qualifying / owning process tools in a TD and/or HVM context is highly desired.
  • Supplier-/geography-relevant language skills a plus.
  • Direct prior process qualification experience with semiconductor packaging suppliers is a plus.

What the JD emphasized

  • customer qualification milestones on-time
  • advanced semiconductor packaging / substrates
  • cross-functional teams across multiple time zones and cultural contexts
  • process building blocks
  • critical process interactions
  • DOE, PCS, and SPC
  • qualifying / owning process tools in a TD and/or HVM context is highly desired
  • Direct prior process qualification experience with semiconductor packaging suppliers is a plus