Assembly Packaging Technical Integrator - Intel Foundry Services Mag

Intel Intel · Semiconductors · Arizona, Phoenix, United States +1

Product Packaging Engineer responsible for designing, developing, and qualifying packaging solutions for Intel's products, ensuring they meet product, regulatory, and environmental requirements. This role involves collaboration with manufacturing, logistics, and supply chain teams, identifying cost-saving measures, conducting risk analyses, and evaluating vendors. Requires technical knowledge in semiconductor packaging, assembly, and reliability analysis.

What you'd actually do

  1. Design, develop, and qualify packaging solutions and materials that meet product, regulatory, and environmental requirements.
  2. Lead packaging development efforts, including creating artwork, prototypes, and detailed specifications.
  3. Collaborate with cross-functional teams to ensure packaging solutions align with manufacturing, logistics, and supply chain needs.
  4. Identify and implement cost-saving measures and processes to enhance efficiency, reduce waste, and promote sustainability.
  5. Conduct risk analyses to ensure compliance with regulations and Intel's high-quality standards.

Skills

Required

  • Bachelor’s degree in Engineering, Material Science, Physics, Chemistry, or a related technical field.
  • 6+ years of experience with a Bachelor’s degree, or 2+ years with a Master’s degree, or a PhD with relevant academic/research experience in semiconductor industry processes, semiconductor packaging, optics, or optical packaging technologies.
  • Design for Manufacturing (DFM) principles
  • semiconductor packaging assembly and production processes
  • optical packaging technologies and semiconductor manufacturing environments
  • data analysis, statistical analysis, yield analysis, or package reliability analysis
  • cross-functional engineering and manufacturing environments

Nice to have

  • Strong communication and collaboration skills
  • Strong analytical and problem-solving skills
  • Ability to manage multiple priorities in a fast-paced technical environment
  • Demonstrated ability to research, develop, and drive innovative technical solutions
  • Strong organizational and documentation skills

What the JD emphasized

  • Technical knowledge and firsthand experience are critical for effective integration of cross functional efforts including Assembly Process technology, Package assembly Design Technology, design services, statistical model-based analysis and Yield and package reliability analysis