Cad/pcb Design Engineer, Pixel Phones

Google Google · Big Tech · Chicago, IL +1

Design Engineer for Google Pixel phones, focusing on CAD/PCB design for custom silicon solutions. Responsibilities include PCB layout, component placement, signal routing, and collaborating with vendors and cross-functional teams. Requires a Bachelor's degree in a related field and 2 years of PCB design experience.

What you'd actually do

  1. Drive the mechanical and electrical design of printed circuit boards (PCBs) from initial concept through mass production, including outline creation, layer stack-up definition, optimal component placement, and high-speed signal routing.
  2. Collaborate closely with board fabrication vendors to establish and implement precise impedance control rules, while ensuring adherence to design for manufacturing (DFM), design for assembly (DFA), and design for testability (DFT) guidelines.
  3. Serve as a key interface between Electrical Engineers, PCB Designers, Mechanical Engineers, and Fabricators, facilitating seamless communication and problem-solving throughout the product development lifecycle.
  4. Foster robust cross-functional partnerships with Electrical Engineering, Product Design, and DFM/DFA teams to optimize designs for performance, manufacturability, and cost-effectiveness.
  5. Utilize advanced CAD tools and methodologies to create and maintain complex PCB layouts, ensuring signal integrity and power delivery meet stringent performance requirements.

Skills

Required

  • Bachelor’s degree in Electrical Engineering, Computer Engineering, Physics, a related field, or equivalent practical experience.
  • 2 years of experience working in PCB design, or 1 year of experience with an advanced degree.

Nice to have

  • Experience with PCB design tools and methodologies.
  • Experience in both flexible printed circuit (FPC) and rigid-flex layout techniques, showcasing versatility in various design challenges.
  • Proficiency in executing high-speed board designs and complex layouts, including a thorough familiarity with high-density Ball-Grid Array (BGA) packages.
  • Knowledge of mechanical design outline formats, ensuring seamless integration and collaboration between electrical and mechanical design teams.
  • Understanding of phases of hardware development, from initial schematic entry and meticulous manual constraint generation to rigorously meeting all design requirements and producing polished board layouts.