Cuf Td Module Engineer

Intel Intel · Semiconductors · Kulim, Malaysia

Develops and optimizes assembly processes and equipment for semiconductor packaging, focusing on manufacturing efficiency, quality, reliability, and cost. This role involves applying experimental design and statistical methods to improve processes, ensuring manufacturability, and meeting customer reliability needs. The role also involves establishing material specifications and collaborating with suppliers. The business group context mentions enabling Intel's roadmap of future assembly packaging platform technologies for the AI era, but the core responsibilities are in traditional manufacturing engineering.

What you'd actually do

  1. Develops assembly processes and/or equipment and applies novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies.
  2. Optimizes and improves the efficiency of manufacturing of packages, developing processes to meet quality, reliability, cost, yield, productivity and manufacturability requirements.
  3. Develops process and equipment specifications applying principles for design of experiments and data analysis, and documents improvements through white papers.
  4. Develops and maintains equipment to evaluate silicon and package technologies under simulated field use conditions, such as heat, humidity, temperature cycle, and dynamic forces.
  5. Ensures manufacturability of physical layout of package design and oversees the cycle of manufactured package processes, procedures and flows.

Skills

Required

  • MSc/PhD degree in Mechanical Engineering/Material Engineering/Electrical Engineering/Chemical Engineering/Physics with focus on thermal/fluid/packaging assembly process engineering or related engineering background, with at least 3 years of working experience.
  • Fundamental understanding of semiconductor assembly equipment and processes.

Nice to have

  • Bachelor's Degree with strong relevant experience
  • Developing new processes through hardware /toolset development is a plus.