Job Details:
Job Description:
The Role and Impact We are seeking a Sr. Principal Engineer, Customer Enabling to lead and drive innovation in Intel's cutting-edge assembly packaging technologies. In this role, you will play a pivotal role in shaping the future of assembly processes and equipment, ensuring Intel's leadership in delivering high-quality products to market. You will work at the heart of technology development, leveraging your expertise to optimize manufacturing processes and solve complex challenges that impact quality, reliability, and cost efficiency. As a recognized domain expert, you will influence technical direction across Intel and the broader industry, mentoring future leaders and driving meaningful advancements in packaging technologies. Your contributions will directly enable Intel to achieve its ambitious roadmap and deliver world-class solutions that power billions of devices worldwide. The Customer Enabling Engineer is responsible for developing and executing strategies that promote Intel Foundry's Advanced Packaging solutions to customers. This role involves engaging with customers to understand their needs, and ensuring end to end ownership of technical engagement.
Some of the key responsibilities includes
- Be the center point of contact for all technical collaboration with the customer, that includes but not limited to Critical to Function Data, Schedule, demand/sample size, reliability requirements, certification, NPI and 1st Silicon coordination with customer etc.
- Collaborate with Customer Packaging team to translate product requirements into package architecture specification, co-define test vehicle and product strategy and manage the schedule, cycle time negotiation.
- Participate in technology tradeoff decisions ensuring packages conform to electrical, mechanical, thermal, and reliability standards, specifications, and landing zones.
- Translate the requirements to the internal execution teams and manage customer dashboards via performance against execution (PAS)
- Collaborate with silicon and package execution leads to ensure high quality outcomes and aids in removing roadblocks.
- Participate and contribute in identifying critical technology solutions for future product needs.
- Partner with design teams to ensure manufacturability of package layouts and processes.
- Innovate by creating reliability requirements, acceleration methods, tools, and quality screens to proactively address packaging quality and reliability challenges.
- Solve complex technical problems related to packaging processes and materials, providing expert consultation and responding to client requests or events.
- Drive standardization of quality systems, product qualification, and methods to ensure excellence in manufacturing and meet product milestones.
- Mentor and develop other technical leaders, cultivating a strong community of innovators who embody Intel's values.
- Formulate technical strategy and align organizational goals with a vision for delivering leadership solutions in packaging technologies.
Required Skills and Experience
- Demonstrated expertise in package design and development, manufacturing quality assurance, and process characterization.
- Demonstrated experience in Testing including Wafer and package Testing
- Proficiency in statistical methods, experimental design, and reliability modeling.
- Technical knowledge in package architecture, testing, and design for manufacturability.
- Proven ability to lead initiatives and deliver results through disciplined execution.
Preferred Skills and Experience
- Strong mentoring and coaching skills, with a history of developing technical leaders.
- Exceptional communication and influence skills, with the ability to drive collaboration across diverse teams and stakeholders.
- Industry recognition for innovation and technical contributions in packaging technology.
- Learning agility and adaptability to rapidly changing environments and challenges.
- Strategic problem-solving abilities and creativity in developing new approaches to quality and reliability.
Qualifications:
- Bachelor's degree in a specialized field such as Materials Science, Mechanical Engineering, Electrical Engineering, or equivalent experience.
- 12+ years of experience in packaging technology development with a Bachelor's degree, 8+ years with a Master's degree, or 6+ years with a PhD.
Job Type:
Experienced Hire
Shift:
Shift 1 (United States of America)
Primary Location:
US, Arizona, Phoenix
Additional Locations:
US, California, Folsom, US, California, Santa Clara, US, Oregon, Hillsboro
Business group:
Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Position of Trust
This role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter.
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $248,400.00-350,690.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.
- ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.