Customer Yield Engineer – Foundry Engineering (taiwan)

Intel Intel · Semiconductors · Hsinchu, Taiwan +1

Customer Yield Engineer responsible for yield interface for assigned foundry customers in Taiwan, providing direct yield support. Works with Yield DRI and cross-functional factory teams in Intel FAB for yield analysis, issue assessment, and recovery. Manages OSAT activities for Intel-owned engineering material, ensuring yield integrity and rapid learning. Collaborates with engineering teams to maintain process stability and deliver technical solutions. Identifies process weaknesses and tool issues using big data, statistical analysis, and advanced analytical methods. Proactively identifies yield risk, variability, and trends, escalating issues with clear impact assessment and recommended actions. Communicates yield status, risks, and recovery plans.

What you'd actually do

  1. Function as the Taiwan-based point of contact for customer yield, providing day-to-day yield engagement and follow-up with Intel Foundry Customers.
  2. Work in close partnership with the Yield DRI and factory teams in Intel Foundry FAB to align on root cause, recovery plans, and execution priorities.
  3. Manage and support OSAT yield activities for Intel-owned ENG material, including yield monitoring, WIP management and ENG debug activities.
  4. Collaborate with cross-functional engineering teams (device, integration, yield, lithography, etch, thin films, test) to maintain process stability and deliver technical solutions.
  5. Identify process weaknesses and manufacturing tool issues using big data, statistical analysis, and advanced analytical methods.

Skills

Required

  • Materials Science, Engineering, Electrical Engineering, Chemical Engineering, Physics, Chemistry, or a related scientific field
  • English and Mandarin (written and verbal)
  • semiconductor manufacturing, foundry, or yield engineering
  • analytical skills
  • data-driven critical thinking
  • collaboration
  • Yield, defect, and parametric data analysis
  • 300mm advanced logic wafer fabrication processes
  • Assembly and test fundamentals
  • OSAT process flows
  • fab-to-OSAT yield interfaces
  • Design-for-test concepts
  • fault isolation
  • yield learning loops
  • Semiconductor device physics, materials, and electrical performance

Nice to have

  • supporting advanced logic technologies in high-volume manufacturing environments
  • collaborating directly with customers and external manufacturing partners (OSATs)
  • drive yield improvement through structured experimentation and data-driven decision-making
  • operating across global FAB and time zones

What the JD emphasized

  • deep technical expertise in yield and process engineering
  • strong data-driven critical thinking skills
  • Proficient in both English and Mandarin (written and verbal)
  • 3 to 5 years of experience in semiconductor manufacturing, foundry, or yield engineering roles
  • Strong analytical skills with direct participation and strong ownership