Device Engineer

Intel Intel · Semiconductors · Leixlip, Ireland

Device Engineer role focused on advanced FinFETs technology, working on yield ramp-up, process and device optimization in a high-volume manufacturing Fab. Responsibilities include driving product roadmaps, executing yield roadmaps, developing new device technology, root cause analysis of yield/performance issues, NPI, and modeling device performance.

What you'd actually do

  1. Drive factory product Power and Performance roadmap and member/leader of the Performance TMI team to ensure the factory products hit customer specifications required, including device targeting, customization, variability improvement etc.
  2. Own engineering projects to execute HVM yield roadmap, device targeting and attain performance targets.
  3. Work with Technology Development team to develop new device technology, customize device architecture per customer request and import to production fabs.
  4. Participate or lead cross-organizational team of engineers to identify root cause of device-related yield/performance issues and define mitigation plan to meet committed production yield/performance targets.
  5. Own NPI (New Product Introduction) in production fab and perform device-related process optimizations to meet foundry customers product specifications and requirements.

Skills

Required

  • Problem Solving
  • Teamwork and Partnership
  • Communication
  • Self-Motivation
  • Flexibility
  • Goal Commitment
  • Relevant Bachelors, Masters and/or a PhD degree in Device physics, Electronics, physics chemistry or related technical field.
  • 5-10 years' experience in advanced node semiconductor industry in Device or FEOL/BEOL Integration.
  • 5-10 years' experience in FinFET technology development or high-volume manufacturing.
  • 5-10 years' experience with Device Physics and hands-on application in real-world fab environment.

Nice to have

  • Advanced degree (Master's or Ph.D.) in Electrical Engineering, Physics or Materials Science major.
  • Experience driving product performance roadmaps working in multi discipline team with Process Engineers, Integration Engineers and Yield Analysis to deliver reliable, cost effective and stable/capable products.
  • Experience working on process transfers to High Volume Manufacturing Factories, solving complex integrated issues delivering matched yields and product performance.
  • Demonstrated interpersonal skills including influencing, engaging, and motivating.
  • Experience in serving external Foundry customers through technical interactions.
  • Experience in GAA (Gate-All-Around) technology architecture.
  • Experience in new semiconductor technology development.
  • Basic understanding and collaboration experience with module processes including lithography, dry etch, wet etch, CMP, diffusion, implant, thin films and metrology.

What the JD emphasized

  • advanced node semiconductor industry
  • FinFET technology development
  • Device Physics and hands-on application in real-world fab environment