Director, Reliability Hardware System

NVIDIA NVIDIA · Semiconductors · Yokneam, Israel

NVIDIA is seeking a senior system HW Reliability manager to lead end-to-end reliability and failure analysis (FA) activities for the Networking organization. The role involves directing multiple system-level teams, coaching managers, and ensuring product stability and long-term performance. Responsibilities include driving investigations for complex failures, influencing product architecture with Build for Reliability (BfR) and Build for Manufacturing (BfM) requirements, and formalizing a "Lessons Learned" process. Requires 15+ years of management experience, deep understanding of Physics of Failure, advanced FA techniques, reliability statistics, and industry standards.

What you'd actually do

  1. Lead the end-to-end reliability and failure analysis (FA) activities for the entire Networking organization. You will be the primary advocate for product stability and long-term performance.
  2. Direct multiple system-level teams. Your focus will be on coaching, mentoring, and developing the next generation of engineering managers, conducting performance evaluations, and scaling the organization’s capabilities.
  3. Act as the reliability "glue" between diverse engineering rigors. You will collaborate closely with Board Build, Mechanics, Thermal, PCB Layout and Production teams to ensure a broad approach to quality.
  4. Drive high-priority "War Room" investigations for complex, intermittent field failures, using advanced FA techniques to reach definitive root causes.
  5. Use statistical tools and physics-of-failure models to predict product life cycles and identify potential wear-out mechanisms before they reach the field.

Skills

Required

  • B.Sc. or M.Sc. in Materials Science and Engineering
  • 15+ overall years of demonstrated management experience with teams of 10+
  • At least 8+ years of management experience
  • Ability to multitask many assignments and coordinate testing for numerous programs
  • Deep understanding of Physics of Failure and reliability physics related to semiconductors, PCBA, and interconnects (e.g., electromigration, stress-induced voiding, thermal fatigue).
  • Hands-on experience with sophisticated Failure Analysis (FA) techniques such as Cross-sectioning, SEM/EDX, CSAM, X-ray, and Dye & Pry to identify root causes at the material and structural level.
  • Proficiency in reliability statistics, including Weibull analysis, accelerated life testing, and MTBF modelling.
  • Comprehensive knowledge of industry standards such as JEDEC, IPC, and Telcordia for component and system-level qualification.
  • Define new processes to improve coverage and overall product quality

Nice to have

  • AI
  • ML
  • Cloud
  • Media and Entertainment

What the JD emphasized

  • management experience with teams of 10+
  • management experience
  • Deep understanding of Physics of Failure and reliability physics related to semiconductors, PCBA, and interconnects
  • Hands-on experience with sophisticated Failure Analysis (FA) techniques