Electrical Engineer, Intelligence Systems

Anduril Anduril · Defense · Reston, VA · AFS : Intelligence Systems Engineering : Software - Intelligence Systems

Electrical Engineer role at a defense technology company focused on designing, developing, and fabricating complex, multilayer printed circuit boards (PCBs) for intelligence systems. The role involves end-to-end ownership of the PCB design-to-manufacture pipeline, collaboration with cross-functional teams, and adherence to rigorous performance and reliability standards. Experience with various board types, high-speed digital interfaces, and CAD tools like Altium Designer is required. A U.S. Top Secret SCI security clearance with Full Scope Polygraph is mandatory.

What you'd actually do

  1. Work directly with project managers to produce PCB designs supporting AIS programs
  2. Apply modern design standards and guidelines to create highly reliable, highly manufacturable assemblies
  3. Implement designs that can support reuse of existing System-on-Chip, System-on-Module cores, or all new designs, as needed, that focus on edge computation, FPGA, deployment, high precision sensors, RF, and both low and high-power designs
  4. Own the end-to-end design-to-manufacture pipeline and bill of material (BOM), coordinating external PCB design and manufacturing, and assembly, as needed, across multiple fabrication and assembly houses
  5. Work in a fast-paced environment, juggling multiple concurrent projects and customers

Skills

Required

  • Bachelor’s degree in electrical engineering or similar and 5+ years of professional experience in PCB design
  • Ability to read and interpret schematics and apply best practices appropriate for each design
  • Expertise in PCB fabrication processes, limitations, design rules, and best practices
  • Experience using Altium Designer CAD tools
  • Experience developing component libraries and library management
  • Experience reworking existing physical and soft PCB designs into different form factors
  • Experience with a variety of board types, including high density and high layer count (greater than 16) digital designs, power electronics, flex circuits, and RF circuits
  • Experience with high-density interconnect (HDI) and thicker boards (greater than 1.6mm)
  • Experience with high-speed digital interfaces and controlled impedance routing requirements like USB, PCIe, Ethernet, SERDES, and DDR memory
  • Strong communication skills
  • Currently possesses and is able to maintain an active U.S. Top Secret SCI security clearance with Full Scope Polygraph

Nice to have

  • Familiarity with other design tools such as OrCAD, Cadence, or Allegro
  • Experience in applying relevant IPC standards, CID, CID+ certification
  • Experience with high-pin count packages (FPGA fanout)
  • Experience with signal and power integrity rules and their effect on layout

What the JD emphasized

  • complex, multilayer printed circuit boards
  • rigorous performance and reliability standards
  • end-to-end design-to-manufacture pipeline
  • tight timelines and resource constraints
  • U.S. Top Secret SCI security clearance with Full Scope Polygraph