WHAT YOU DO AT AMD CHANGES EVERYTHING
At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. **Together, we advance your career. **
THE ROLE
As part of the AMD's Advanced Packaging team, you will drive technology development of advanced 3D package architectures. The scope includes but not limited to: execute and coordinate proof of concept on new technology; product bring up and continue yield and reliability improvement to meet performance, cost, and schedule requirements to support new AMD products.
THE PERSON
The candidate should have a proven track record and extensive knowledge and experience in wafer process Integration, such as BEOL Integration, 3D integration with TSV and Hybrid Bonding (CoW and W2W) etc. The candidate should have a hands-on approach to process bring up and development as well as excellent oral and written communication skills to communicate ideas with Technology Partners, Colleagues, Product Architects and AMD Management.
KEY RESPONSIBILITIES
- Drive/participate in defining FMEA, TV Design, DFM, and DFY. Manage DOE plan and execution for material selections, process window validation. Defining quality and reliability tests including defect detection and FA methodology
- Partner with AMD architects, designers, and product owners to develop high yielding, cost-effective solutions which meet product requirements. Transfer the new product into a high yielding, cost-effective, high-volume manufacturing environment.
Enable development partners in the AMD Ecosystem to bring up new packaging technology/process from concept to NPI and prototyping to mass production. lead and perform process optimization, yield and reliability improvement.
PREFERRED EXPERIENCE
- Fundamental knowledge and hand-on experience with BEOL process, TSV integration and Hybrid bonding process and defect metrology.
- Good knowledge in design and reliability, such as TV design, CPI, Thermo-mechanical analysis, DFR etc.
- Good knowledge with Advanced Packaging Techniques, including fan-out, 3D stacking, 2.5D and MCM packaging techniques;
- Experience in the industry with strong problem solving, communication, organizational, interpersonal, and presentation skills.
ACADEMIC CREDENTIALS
- Master of Science/PhD in materials, mechanical, chemical, or electrical engineering.
This role is not eligible for visa sponsorship.
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_Benefits offered are described: _AMD benefits at a glance.
AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.
AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.
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This posting is for an existing vacancy.