Foundry Customer Integration Engineer

Intel Intel · Semiconductors · Arizona, Phoenix, United States

Customer Integration Engineer role at Intel Foundry, focusing on integrating semiconductor technologies for foundry customers. Responsibilities include identifying patterns from customer engagements, abstracting them into foundry standards, supporting customer improvement projects, responding to process issues, and collaborating with internal teams to ensure seamless technology integration and customer satisfaction. Requires strong problem-solving, communication, and project management skills within the advanced node semiconductor industry.

What you'd actually do

  1. Critical Responsibility will be for identifying recurring patterns and learnings from customer engagements, abstracting these into foundry standards, systemising, automating and proliferating them across other technologies and customers.
  2. Be the DRI (Directly Responsible Individual) to support customer improvement projects and respond to process issues on behalf of the customer. Will be responsible for regular communication with the customer and from the customer to the factory. Be the single point of contact for FEOL and/or BEOL process integration issues for customer.
  3. Collaborate with Technology Development team to import new technology to Customer Products.
  4. Work with FEOL/BEOL Integration, Device, Defect Reduction and Yield Analysis team members to identify root cause of yield/performance issues and implement mitigation plan in defined timeline to meet committed production yield/performance targets and to support fast paced yield ramp-up in high-volume manufacturing phases.
  5. Own engineering projects to improve product yield, quality, performance and to reduce wafer cost.

Skills

Required

  • Bachelor's degree in Electrical Engineering, Materials Science, Physics, or related STEM field
  • 10+ years' experience in advanced node semiconductor industry in FEOL and/or BEOL Process Integration
  • 10+ years' experience in advanced node semiconductor development or high-volume manufacturing
  • Problem-solving technique
  • Strong self-initiative and self-learning capabilities
  • Ability to work with multi-functional, multi-cultural teams
  • Excellent communications skills
  • High degree of ownership for problems with a high tolerance for ambiguity
  • Interpersonal skills including influencing, engaging, and motivating

Nice to have

  • Advanced degree (Master's or Ph.D.) in Electrical Engineering, Physics or Materials Science
  • 7+ years of experience collaborating with module processes including lithography, dry etch, wet etch, CMP, thin films and metrology
  • 7+ years of applied industrial experience in Semiconductor process integration, device physics, logic, architecture and integration, and interconnect development on leading-edge technology nodes
  • 7+ years of: Strong project management skills with ability to manage timelines, risks, and deliverables across multiple stakeholders
  • Experience with Process Design Kit (PDK) silicon model target generation and use, silicon-to-simulation correlation, test structure design, device modeling, and electrical characterization

What the JD emphasized

  • Critical Responsibility
  • DRI (Directly Responsible Individual)
  • Must be highly organised
  • Must demonstrate excellent communications skills
  • Must possess a high degree of ownership