Foundry Services Advanced Packaging Account Technical Solutions Engineer

Intel Intel · Semiconductors · Arizona, Phoenix, United States +4

This role is for an experienced Technical Solutions Engineer focused on semiconductor packaging and test within Intel Foundry Services. The engineer will manage customer relationships, provide technical consultation on packaging solutions, and collaborate with internal teams to influence product roadmaps. Responsibilities include developing Statements of Work, managing the customer engagement lifecycle, and acting as the Voice of the Customer within Intel.

What you'd actually do

  1. Own the end-to-end customer relationship as the primary interface between the customer and Intel, ensuring seamless communication, trust, and alignment across all phases of engagement.
  2. Work directly with customer to understand packaging challenges and requirements and provide technical consultation on packaging solutions and processes.
  3. Engage expert stakeholders across Intel Foundry to ensure customers have firsthand access to information.
  4. Collaborate with cross-functional teams including Technology Development, Product Engineering, Manufacturing and Operations, and Customer Engineering teams providing feedback to influence product and technology roadmaps.
  5. Lead and coordinate all internal Intel interactions related to the customer account to drive commitment to execution across schedule, quality, technical execution, qualification and volume ramp.

Skills

Required

  • Semiconductor Packaging
  • communication
  • project management
  • customer-facing skills
  • technical and operations discussions
  • Problem-solving
  • analytical thinking
  • explain complex technical concepts
  • travel

Nice to have

  • Semiconductor Packaging
  • communication
  • project management
  • customer-facing skills
  • technical and operations discussions
  • Problem-solving
  • analytical thinking
  • explain complex technical concepts
  • travel

What the JD emphasized

  • AI era