Lead Diagnostics Software Engineer, Ate Integration

AMD AMD · Semiconductors · MARKHAM, Canada · Engineering

Lead/Principal Diagnostics Engineer to drive shift from post-silicon software validation frameworks and System-Level Tests (SLT) directly into Automated Test Equipment (ATE) and Wafer Sort environments. Design architecture, tooling, and translation methodologies to pack, convert, and stream complex software-driven GFX and compute test cases into production-grade ATE patterns.

What you'd actually do

  1. Define the technical roadmap, architecture, and deployment strategy for migrating post-silicon SLT and functional GFX IP feature diagnostics onto wafer sort and ATE hardware configurations.
  2. Architect and develop software utilities/pipelines to convert functional diagnostic sequences, register configurations, and compute workloads into cycle-accurate vector formats (e.g., STIL, WGL, or proprietary tester formats) compatible with high-end ATE testers.
  3. Serve as the primary technical liaison between the GFX/Compute Diagnostics team, Product/Test Engineering, and Design-for-Test (DFT) teams
  4. Analyze existing platform-level hardware/software dependencies (such as sideband management interfaces, firmware, and power management behaviors) to build deterministic, tester-friendly models that emulate host behaviors on ATE hardware.
  5. Optimize tester execution times (test cost reduction) while maximizing structural and functional test coverage for data center GPU IPs, focusing on massively parallel compute pipelines, high-bandwidth memory (HBM) controllers, and matrix math engines.

Skills

Required

  • C/C++
  • Python
  • bare-metal or driver-level programming
  • registers
  • firmware interactions
  • system memory maps
  • production-grade Automated Test Equipment platforms (e.g., V93000, UltraFLEX)
  • structural/functional testing at the wafer sort or final test level
  • structural pattern generation
  • vector timing
  • clock domains
  • diagnostic patterns (such as functional vectors, BIST/MBIST, or scan compression output)
  • high-volume manufacturing challenges unique to data center architectures
  • high-power profiles
  • HBM integration
  • multi-die chiplet interconnect protocols (e.g., UCIe, proprietary fabrics)
  • GFX and compute architectures
  • diagnostic and test cases
  • DevOps environment like GitHub, CI/CD pipelines
  • problem-solving abilities
  • keen eye for detail

Nice to have

  • AI/ML principles
  • LLM & ML models in applications