Manager, Mechanical Engineering

NVIDIA NVIDIA · Semiconductors · Yokneam, Israel

Manager for Mechanical Engineering team focused on thermal and mechanical solutions for NVIDIA's networking products, supporting AI and networking infrastructure. Responsibilities include leading teams, developing cooling solutions (liquid and air), and managing mechanical analysis, materials, and manufacturing processes.

What you'd actually do

  1. Manage and lead three complementary teams of 15+ Engineers across three complementary teams, including a Mechanical Analysis team covering chip to rack level structural simulations
  2. Lead the Mechanical Design team developing next-generation thermal/mechanical solution and Materials experts enabling advanced material, TIM, and joining technologies.
  3. direct a multidisciplinary R&D team engaged in a variety of areas, including mechanical design supporting thermal solutions, mechanical analysis, soldering technologies, materials and manufacturing processes for production lines, etc.
  4. Support designs of advanced thermal solutions for NVIDIA next generation products, focusing on both liquid cooled and air-cooled thermal solutions.

Skills

Required

  • Mechanical Engineering
  • Thermal Engineering
  • Team Leadership
  • Mechanical Analysis
  • Materials Science
  • Liquid Cooling
  • High-power electronic systems

Nice to have

  • Liquid cooling scaling challenges
  • Advanced TIM / materials direction
  • Enabling new technologies
  • Balancing innovation with manufacturability
  • Chip → rack system thinking

What the JD emphasized

  • M.Sc. in Mechanical Engineering or equivalent degree
  • 8+ overall years of experience and at least 4+ years of proven leadership experience managing thermal and mechanical development teams
  • Strong experience in mechanical and thermal analysis methodologies
  • Proven experience developing advanced thermal solutions, including liquid cooling technologies, from concept through mass production
  • Strong understanding of thermo-mechanical challenges in high-power electronic systems
  • Experience working across multiple physical scales, from chip level to system level
  • Ability to lead multidisciplinary engineering activities and drive execution