In this role, you will accelerate our investigations into new materials, associated fabrication processes, and testing procedures. You will be responsible for developing and troubleshooting new and existing processes for the fabrication of wiring, interconnects, and packaging components that are critical for building our next generation of quantum computers. You will collaborate with other researchers and engineers on the Quantum Artificial Intelligence team to develop new materials, use and expand our current capabilities, and identify processes and equipment to take us in new directions of higher performance materials for more densely-integrated superconducting quantum computing systems. You will work directly with research scientists and other hardware engineers to develop materials to enhance our superconducting hardware stack including packaging, input/output, and associated filtering. You will drive hardware implementation and testing efforts to validate these materials in the lab by building and analyzing materials using performance focused experiments.The full potential of quantum computing will be unlocked with a large-scale computer capable of complex, error-corrected computations. Google Quantum AI's mission is to build this computer and unlock solutions to classically intractable problems. Our roadmap is focused on advancing the capabilities of quantum computing and enabling meaningful applications.
The US base salary range for this full-time position is $159,000-$231,000 + bonus + equity + benefits. Our salary ranges are determined by role, level, and location. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific salary range for your preferred location during the hiring process.
Please note that the compensation details listed in US role postings reflect the base salary only, and do not include bonus, equity, or benefits. Learn more about benefits at Google.
Responsibilities
- Research and develop new materials for use in wiring, interconnects and packaging for superconducting quantum computing.
- Develop and optimize processes with vendors and integrate them into component fabrication flows.
- Specify, procure, and bring up capital processing and testing equipment
- Drive partners and give technical input for processes that are performed externally.
- Sustain and improve existing processes with a focus on materials performance, throughput, yield and component reliability.
Qualifications
Minimum qualifications:
- Bachelor’s degree in Materials Science, Electrical Engineering, Physics, a related technical field, or equivalent practical experience.
- 5 years of experience working in a fabrication facility such as a semiconductor cleanroom, a PCB manufacturing facility, or in base materials generation.
- Experience in one or more thin film deposition methods (e.g., PVD, PECVD, electroplating, etc.).
Preferred qualifications:
- Experience in multiple thin film deposition methods (e.g., PVC, CVD, ALD, MBE, electroplating).
- Experience with metrology and failure analysis (e.g., SEM, EDAX, AVI, profilometers, FIB, and cross-section analysis).
- Experience working with superconducting materials.
- Experience driving yield improvement efforts, Six Sigma methods, SPC, and DOE.
- Experience with reliability engineering and failure analysis methods.