Mechanical Design Engineer – Semiconductor Packaging

Intel Intel · Semiconductors · Arizona, Phoenix, United States

Mechanical Design Engineer responsible for designing Tape and Reel packaging, substrates, heat spreaders, and other mechanical components for semiconductor packaging and assembly. Requires CAD skills and collaboration with cross-functional teams.

What you'd actually do

  1. Design Tape and Reel packaging for semiconductor die shipments from Fab to Assembly.
  2. Develop and maintain mechanical designs and detailed drawings for: Substrates, Integrated Heat Spreaders (IHS), Stiffeners, Overall package assemblies
  3. Design process media trays used during various stages of the assembly process.
  4. Collaborate closely with architecture, process, and assembly teams to ensure design intent and manufacturability.
  5. Act as the single point of contact for all packaging mechanical design collateral needs.

Skills

Required

  • US Citizenship
  • Ability to obtain and maintain a US Government TS/SCI Security Clearance with Polygraph
  • Bachelor's degree in mechanical engineering or in a STEM related field of study
  • 1+ years' experience with CAD tools such as SolidWorks, Siemens NX, and AutoCAD or similar 2D and 3D CAD software

Nice to have

  • Master's degree in mechanical engineering or in a STEM related field of study
  • Solid mechanical design foundation and 3D spatial awareness
  • Excellent communication and interpersonal skills for effective cross-functional collaboration
  • Ability to interpret and generate technical drawings and specifications

What the JD emphasized

  • US Citizenship required
  • Ability to obtain and maintain a US Government TS/SCI Security Clearance with Polygraph