WHAT YOU DO AT AMD CHANGES EVERYTHING
At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. **Together, we advance your career. **
THE ROLE:
As a Mechanical Engineer within AMD’s AECG Embedded team, you will play a key role in developing advanced thermal-mechanical solutions for next-generation SoC, CPU, and GPU products. You’ll work at the intersection of design, simulation, and validation—contributing to cooling technologies, package integration, and system-level reliability. This is a highly collaborative role where you’ll partner with cross-functional teams to deliver high-performance, manufacturable solutions.
THE PERSON:
You are a hands-on engineer who thrives in a fast-paced, collaborative environment. You bring strong analytical thinking, curiosity, and attention to detail, along with a passion for solving complex engineering challenges. You communicate effectively, take ownership of your work, and are motivated to continuously learn and innovate.
KEY RESPONSIBILITIES:
- Design and validate thermal solutions for SoC, CPU, and GPU products (e.g., heat sinks, vapor chambers, liquid cooling cold plates, fan modules)
- Perform thermal-mechanical FEA simulations across package, board, and system levels to optimize stress, warpage, and reliability
- Evaluate and integrate new materials and packaging technologies to enhance performance and product robustness
- Support DFM/DFA activities and ensure designs meet manufacturability, cost, and quality targets
- Conduct characterization and validation using techniques such as DIC and warpage measurement tools
- Collaborate in cross-functional design reviews and drive issue resolution from development through production
- Partner with suppliers to ensure scalable, high-quality manufacturing solutions
- Develop technical documentation including specifications, reports, and analysis results
PREFERRED EXPERIENCE:
- Experience in mechanical product development, with exposure to semiconductor packaging or thermal cooling design
- Proficiency in FEA tools (e.g., ANSYS) for structural and thermal analysis
- Strong 3D CAD skills (Creo, Pro/E, SolidWorks) and understanding of GD&T and tolerance analysis
- Familiarity with DFM/DFA principles and reliability considerations
- Working knowledge of warpage and failure analysis techniques (e.g., DIC, Shadow Moiré, X-ray, C-SAM)
ACADEMIC CREDENTIALS:
- Bachelor’s, Master’s, or PhD in Mechanical Engineering, Mechatronics, or a related field
This role is not eligible for visa sponsorship.
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_Benefits offered are described: _AMD benefits at a glance.
AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.
AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.
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This posting is for an existing vacancy.