Mechanical Engineer Annapurna Labs , Annapurna Labs, Machine Learning Hardware

Amazon Amazon · Big Tech · Austin, TX · Hardware Development

Mechanical Engineer responsible for the design and optimization of hardware (specifically thermal and mechanical aspects) for large-scale server deployments in Amazon's data centers, supporting custom chips and accelerators for AWS services like ML Trainium and Inferentia.

What you'd actually do

  1. As a Thermal/Mechanical Engineer, you design and build the systems that are the heart of the world's largest and most powerful computing infrastructure.
  2. You develop from the lowest levels of circuit design to large system design and see those systems all the way through to high volume manufacturing.
  3. Your work has the potential to shape the machinery that goes into our cutting-edge data centers affecting millions of AWS users.
  4. Collaborate effectively with teams spanning multiple sites and develop detailed specifications for product teams to use
  5. Work with ODMs, heatsink vendors, and internal design teams on cross-boundary triaging, debugging, and resolving issues across organization

Skills

Required

  • Mechanical and Thermal design of Systems
  • thermal and performance measurements and characterization on SoCs, Servers, and Systems
  • SoC Thermal modeling and IC package transient thermal response
  • Chip package, System Mechanical & Thermal design for air-cooled and liquid-cooled systems
  • Collaborate effectively with teams spanning multiple sites
  • develop detailed specifications for product teams to use
  • Work with ODMs, heatsink vendors, and internal design teams

Nice to have

  • Knowledge of SoC thermal/mechanical design methodology, power modeling and thermal analysis techniques
  • Ansys Icepak, FloTherm, Cadence Celsius, PTC Creo, and Solidworks
  • Bash script, Shell script, Linux, Python, and Lua
  • working in Linux environment
  • fans, valves, chillers, and CDUs
  • various types of technologies used for Heatsink solutions, Thermal Interface Materials (TIMs) and liquid cooling technologies
  • CFD and compact RC models for SoC and Package thermal analysis
  • hardware and software based thermal / power management control algorithms
  • Optimize thermal solutions under PPA and system design constraints
  • Simulate and prototype thermal control strategies
  • Validate thermal models through power/thermal measurements on Hardware