Mechanical Tooling Engineer

Intel Intel · Semiconductors · Arizona, Phoenix, United States

Mechanical Tooling Engineer responsible for developing and enabling Intel's next-generation advanced packaging and test technologies. This role involves the definition, design, and deployment of tooling and hardware solutions for semiconductor packaging, including process integration, equipment solutions, and feasibility studies. Responsibilities include leading the design and development of manufacturing processes, optimizing operating equipment, and collaborating with suppliers.

What you'd actually do

  1. Drives technology development and enablement for both high volume manufacturing and future technology, provides process integration and equipment solutions, and performs feasibility studies to meet desired device specifications.
  2. Leads design and development of technically sophisticated manufacturing processes and/or repair reverse engineering including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirements.
  3. Performs pathfinding activities in support of process and hardware development enabling manufacturing of innovative device architectures and develops roadmaps for technologies enabling future roadmap.
  4. Recommends and implements modifications for operating equipment to improve production efficiency, manufacturing techniques, and optimizing production output for existing products.
  5. Partners with key equipment and materials suppliers to develop and implement enabling elements of the technology.

Skills

Required

  • Solid modeling CAD tools such as Pro/Engineer (Creo), SolidWorks, or AutoCAD
  • Geometric Dimensioning & Tolerancing (GD&T) and applying it to mechanical component or tooling design
  • Mechanical engineering experience in tooling, fixtures, or precision hardware development

Nice to have

  • Thermal‑mechanical tooling design, development, verification, and validation
  • Laboratory experimentation: test setup creation, data collection/analysis, debugging, and validation
  • Design for Manufacturability (DFM) and process capability improvement
  • Analytical root‑cause methodologies (5‑Why, Ishikawa, structured debugging)
  • Tolerance analysis, FEA modeling, pre‑design simulation work
  • MATLAB or similar analytical tools
  • Basic electrical schematics and hardware troubleshooting
  • Six Sigma / statistical methodologies (Basic Stat, DOE, reliability statistics)
  • Program management or RF tooling development
  • Elastomer socket technology, elastomer‑based interfaces, or compliant mechanical interconnect systems.