Micro-electronics Technician - 2nd Shift

Anduril Anduril · Defense · Hudson, NH · Mission Systems : Imaging Engineering

Anduril Industries is a defense technology company seeking a Micro-electronics Technician for their AIRS team. The role involves executing complex wire bonding operations, performing microelectronic assembly, interpreting technical documentation, setting up and optimizing equipment, and conducting quality assurance inspections. The ideal candidate will have proven proficiency in wire bonding and microelectronic assembly, strong manual dexterity, and the ability to work under a microscope. This is a second shift position.

What you'd actually do

  1. Execute Complex Wire Bonding Operations: Operate and maintain a variety of wire bonding equipment, including manual, semi-automatic, and automated bonders (e.g., Westbond), to perform precise gold ball, wedge, ribbon, alloy, and manganin wire bonding (e.g., 0.001" diameter) onto various substrates such as duroid and ceramic, capacitors, resistors, diodes, and spirals.
  2. Perform Microelectronic Assembly: Conduct intricate assembly tasks, including the careful mixing and application of various adhesives, glues, and epoxies, and the integration of micro-electronic components such as temperature diodes, capacitors, and alumina materials.
  3. Interpret Technical Documentation: Accurately read and interpret detailed build sheets, Interface Control Documents (ICDs), and engineering drawings, ensuring meticulous adherence to complex specifications and process requirements.
  4. Equipment Setup and Optimization: Independently perform setup, calibration, and make minor adjustments to wire bonding machinery, optimizing parameters such as loop heights to achieve superior bond quality and throughput.
  5. Quality Assurance and Inspection: Conduct rigorous in-process and final inspections, utilizing measurement equipment (e.g., reticle, indicator, microscope, bond puller) to verify bond quality and ensure full compliance with design specifications and quality standards.

Skills

Required

  • High School Diploma or equivalent
  • Hands-on experience in wire bonding or microelectronic manufacturing OR equivalent practical skills from a technical bootcamp or certification program
  • Proficiency in various wire bonding techniques (manual gold ball, wedge, ribbon; semi-automatic; automated)
  • Proficiency in intricate microelectronic assembly, including precise adhesive and epoxy application
  • Exceptional manual dexterity
  • Ability to work consistently and accurately under a microscope for an entire shift
  • Ability to read, interpret, and follow detailed technical documentation (build sheets, ICDs, engineering drawings)
  • Commitment to maintaining a clean, safe, and ESD-compliant work environment

What the JD emphasized

  • Must be a U.S. Person due to required access to U.S. export controlled information or facilities