Micro-electronics Technician

Anduril Anduril · Defense · Hudson, NH · Mission Systems : Imaging Engineering

Anduril Industries is a defense technology company seeking a Micro-electronics Technician for their AIRS team. The role involves executing complex wire bonding operations, performing microelectronic assembly, interpreting technical documentation, setting up and optimizing equipment, and conducting quality assurance and inspections. The technician will contribute to the production of high-performance cooled infrared cameras and components, supporting the company's advanced sensing systems.

What you'd actually do

  1. Execute Complex Wire Bonding Operations: Operate and maintain a variety of wire bonding equipment, including manual, semi-automatic, and automated bonders (e.g., Westbond), to perform precise gold ball, wedge, ribbon, alloy, and manganin wire bonding (e.g., 0.001" diameter) onto various substrates such as duroid and ceramic, capacitors, resistors, diodes, and spirals.
  2. Perform Microelectronic Assembly: Conduct intricate assembly tasks, including the careful mixing and application of various adhesives, glues, and epoxies, and the integration of micro-electronic components such as temperature diodes, capacitors, and alumina materials.
  3. Interpret Technical Documentation: Accurately read and interpret detailed build sheets, Interface Control Documents (ICDs), and engineering drawings, ensuring meticulous adherence to complex specifications and process requirements.
  4. Equipment Setup and Optimization: Independently perform setup, calibration, and make minor adjustments to wire bonding machinery, optimizing parameters such as loop heights to achieve superior bond quality and throughput.
  5. Quality Assurance and Inspection: Conduct rigorous in-process and final inspections, utilizing measurement equipment (e.g., reticle, indicator, microscope, bond puller) to verify bond quality and ensure full compliance with design specifications and quality standards.

Skills

Required

  • High School Diploma or equivalent
  • hands-on experience in wire bonding or microelectronic manufacturing OR demonstrate equivalent practical skills gained from a technical bootcamp or certification program in a related field
  • Proven proficiency in various wire bonding techniques (manual gold ball, wedge, ribbon; semi-automatic; automated)
  • intricate microelectronic assembly, including precise adhesive and epoxy application
  • Exceptional manual dexterity and the ability to work consistently and accurately under a microscope for an entire shift
  • Strong ability to read, interpret, and follow detailed technical documentation such as build sheets, ICDs, and engineering drawings
  • commitment to maintaining a clean, safe, and ESD-compliant work environment

What the JD emphasized

  • Must be a U.S. Person due to required access to U.S. export controlled information or facilities