Microelectronics Packaging Engineer (level 3/4)

Northrop Grumman Northrop Grumman · Aerospace · Linthicum Heights, MD +1 · Electrical

Northrop Grumman is seeking an experienced Electro-Mechanical Engineer (Level 3/4) to lead mechanical design, analysis, integration, and testing for RF and EO aperture designs supporting satellite programs. The role focuses on the mechanical development of micro-circuit technology for antennas, sensors, and electronics chassis, including tile sensor assemblies and circuit card assemblies. Responsibilities include design, CAD modeling, documentation, fabrication support, testing, and research for micro-circuit advancements.

What you'd actually do

  1. Responsible for the mechanical development of advanced micro-circuit design as well as the assemblies that they support. (Ex. RF Tile Assemblies)
  2. Responsible for the development of microcircuit advancements that are funded by internal NGC IRAD
  3. Understanding of all aspects of hardware development. This will encompass all phases of design, including concept and detailed design development, CAD modeling efforts, documentation release, fabrication, integration, factory support and testing
  4. Responsible for understanding technical performance of mechanical requirements of space program microcircuit hardware or subsystems (tile assemblies) of major satellite programs to assure cost, schedule and technical performance is achieved
  5. Understand the integration and test process of space hardware and the special tooling that may be required

Skills

Required

  • Mechanical design
  • Analysis
  • Integration
  • Testing
  • CAD modeling
  • Space environments
  • Micro-electronic designs

Nice to have

  • RF Tile Assemblies
  • circuit card assemblies
  • proposals of new space sensors designs
  • payload sensor components
  • customer mechanical requirements
  • broader aspects of the overall sensor and system design
  • space sensor elements
  • special tooling
  • root cause and corrective actions
  • troubleshoot issues with hardware designs
  • knowledge sharing and mentoring

What the JD emphasized

  • micro-circuit development