Module Development Engineer

Intel Intel · Semiconductors · Oregon, Hillsboro, United States

Module Development Engineer at Intel, focusing on dry etch process innovations for high volume semiconductor manufacturing. Requires expertise in plasma physics, process integration, advanced data analytics, and DOE. The role involves technical ownership, defining long-term technical direction, and influencing cross-functional teams and suppliers to enable new device architectures and future technology roadmaps. Experience in advanced logic or foundry technologies, and a strong publication/patent record are preferred.

What you'd actually do

  1. Drives technology development and enablement for both high volume manufacturing and future technology, provides process integration and equipment solutions, and performs feasibility studies to meet desired device specifications.
  2. Leads design and development of technically sophisticated manufacturing processes and/or repair reverse engineering including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirements.
  3. Performs pathfinding activities in support of process and hardware development enabling manufacturing of innovative device architectures and develops roadmaps for technologies enabling future roadmap.
  4. Recommends and implements modifications for operating equipment to improve production efficiency, manufacturing techniques, and optimizing production output for existing products.
  5. Partners with key equipment and materials suppliers to develop and implement enabling elements of the technology.

Skills

Required

  • technical ownership and delivery of dry etch process innovations
  • high volume manufacturing
  • yield improvement
  • reliability
  • technology node transitions
  • plasma physics
  • plasma-surface interactions
  • pattern fidelity
  • selectivity
  • defectivity
  • profile control
  • advanced device structures
  • define long term technical direction
  • translate research concepts into manufacturable solutions
  • advanced data analytics
  • statistical modeling
  • design of experiments (DOE)
  • complex semiconductor process problems
  • technical authority
  • influences decisions across modules, organizations, or technology programs

Nice to have

  • developing and deploying next generation dry etch solutions
  • advanced logic or foundry technologies
  • FinFET
  • GAA
  • nanosheet architectures
  • advanced etch technologies
  • High aspect ratio plasma etch (HARC)
  • Atomic Layer Etch (ALE)
  • EUV patterned layer etch integration
  • Radical and Vapor phase isotropic etching
  • Ash and surface treatments
  • Novel patterning or materials specific etch solutions
  • breaking technical bottlenecks
  • product ramp success
  • cost
  • yield across multiple process nodes or product generations
  • advanced materials and device characterization
  • SEM
  • TEM
  • CD SEM
  • AFM
  • XPS
  • electrical correlation
  • publication record
  • patent record
  • internal technology disclosure record
  • field level or industry recognized contributions
  • mentor senior engineers
  • set technical standards
  • elevate organizational capability
  • dry etch discipline
  • influencing cross functional and external stakeholders
  • integration
  • device
  • yield
  • equipment suppliers
  • align on long term technical strategies
  • shaping multiyear roadmaps
  • process platforms
  • tooling strategies
  • foundational etch capabilities
  • PhD with 10+ years of directly relevant experience
  • Master's degree with 15+ years of experience
  • Chemical Engineering
  • Materials Science
  • Physics
  • Electrical Engineering
  • semiconductor related STEM field
  • dry etch in a foundry

What the JD emphasized

  • Proven track record of technical ownership and delivery of dry etch process innovations that enabled high volume manufacturing, yield improvement, reliability, or technology node transitions.
  • Expert level understanding of plasma physics, plasma-surface interactions, pattern fidelity, selectivity, defectivity, and profile control for advanced device structures.
  • Demonstrated ability to define long term technical direction and translate research concepts into manufacturable solutions at scale.
  • Extensive experience with advanced data analytics, statistical modeling, and design of experiments (DOE) applied to complex semiconductor process problems.
  • Recognized technical authority who influences decisions across modules, organizations, or technology programs without formal management authority.