Module Development Engineer

Intel Intel · Semiconductors · Oregon, Hillsboro, United States

This role focuses on the development and optimization of advanced semiconductor manufacturing processes, including material selection, parameter adjustments, equipment metrology, and system design. It involves feasibility studies, process technology development, and collaboration with suppliers to integrate new technologies into manufacturing. The role requires a PhD in a STEM discipline and fundamental knowledge of plasma physics, surface reactions, thin film processes, and semiconductor materials.

What you'd actually do

  1. Develop and optimize advanced manufacturing processes including material selection, parameter adjustments, equipment metrology, and system design
  2. Conduct feasibility studies and pathfinding activities to support innovative device architectures and manufacturing roadmaps
  3. Design and implement modifications to operating equipment to improve efficiency and production output
  4. Collaborate with equipment and material suppliers to establish enabling technology solutions and integrate them into manufacturing processes
  5. Perform process technology feasibility studies using theoretical simulations and practical engineering methods

Skills

Required

  • Fundamental knowledge of plasma physics, surface reactions, thin film processes, and semiconductor materials
  • Experience with experimental design, data collection, and statistical analysis
  • Ability to analyze process results and clearly document findings in technical reports and presentations
  • Strong problem solving skills and ability to work independently while collaborating in cross functional teams
  • Effective written and verbal communication skills in a technical environment
  • Willingness to work in a fab or lab environment and follow strict safety and contamination control protocols

Nice to have

  • PhD research focus specifically related to plasma etch, pattern transfer, or advanced logic/memory process integration
  • Hands on experience with production or pilot line dry etch tools (e.g., Lam, Applied Materials, TEL, ASM, Hitachi)
  • Knowledge of advanced node challenges such as high aspect ratio etching, CD control, etch selectivity, and damage mitigation
  • Experience with Design of Experiments (DOE) and statistical process control (SPC)
  • Familiarity with process integration, yield learning, or technology development methodologies
  • Programming or scripting experience for data analysis or automation (e.g., Python, MATLAB, JMP, or similar tools)
  • Exposure to foundry or industrial semiconductor Research and Development environments through internships, collaborations, or joint research programs
  • Ability to manage multiple experiments or development tasks in a fast paced, manufacturing driven Research and Development setting
  • Demonstrated interest in transitioning academic research into high volume manufacturing solutions
  • Hands on research experience with dry etch-related topics (e.g., plasma etching, RIE, ICP, ALE) through academic research, dissertation work, or internships
  • Working understanding of semiconductor manufacturing process flows and device structures
  • Familiarity with common semiconductor characterization techniques (e.g., SEM, TEM, AFM, XPS, ellipsometry)

What the JD emphasized

  • PhD in a STEM discipline such as Electrical Engineering, Materials Science, Applied Physics, Chemical Engineering, Chemistry, or a closely related field with at least 6+ months relevant experience