Module Development Engineer- Hybrid Bonding

Intel Intel · Semiconductors · Oregon, Hillsboro, United States

Module Development Engineer focused on equipment maintenance, repair, and continuous improvement in a semiconductor manufacturing environment. The role involves process development, optimization, technical support, and new product introduction, requiring strong analytical and problem-solving skills. Experience with databases, statistical process control, and failure analysis is desired.

What you'd actually do

  1. Owning execution of maintenance and repair activities for equipment and relevant module of components.
  2. Engaging in hands-on training and development activities, managing process equipment and hardware, ensuring optimal functionality and availability.
  3. Owning process development line items aligned to high volume process nodes.
  4. Assessing, improving, and optimizing processing techniques and methods used in high-volume manufacturing settings, ensuring safety and quality standards are met.
  5. Providing expert technical support to manufacturing operations, aiding in the resolution of complex issues through comprehensive analysis of variable factors.

Skills

Required

  • MS Degree in mechanical engineering, Electrical and/or Electronic Engineering, Chemical Engineering, Computer Engineering, or related STEM field.
  • Fab process experience
  • Database experience
  • Analysis knowledge in Excel, JMP, Power Query, SQL, MATLAB, SOLIDWORKS, JMP, Power BI, Arduino, C++, Python, MES.
  • Technical knowledge in statistical process control, commonality analysis, design of experiment and failure modes/effects analysis (FMEA).

Nice to have

  • Graduates with up to 2 years of relevant experience
  • prior experience in the semiconductor industry
  • a manufacturing environment