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Job Role and Responsibility: AMD, Inc., is hiring MTS Packaging Engineer to Evaluate materials and components and processes for use in advanced semiconductor products that must meet specialized design and performance specifications in high volume semiconductor manufacturing. Drive for supplier engagement on continuous improvement and new capabilities ahead of need. Plan and drive for New Product Introduction activities and Ramp Up readiness with external manufacturing partners and AMD internal stakeholders. Drive external manufacturer on issue resolution and issue prevention. Plan and execute change management from internal or external parties. Involved in regional supplier management – drive to meet Key Performance Indices. Coordinates market intelligent analysis to identify value engineering initiatives and derive short- and long-term Value Engineering roadmap to support AMD product portfolio. Prepare and present Executive Summary of projects and supplier’s performance. Coordination of activities within/external team to deliver critical metrics. Develop packaging technology to support performance in high-speed interfaces along with high thermo-mechanical, quality and reliability requirements, including bumping/CPI, package, substrate and assembly. Manage product, components, and materials from conceptual phase to high volume manufacturing on various aspects of packaging work with package and board level (system level) signal integrity (SI) simulation using multiple high-speed interfaces. Enhance package and board level performance with SI simulation tools, and integrate SI/PI guidelines and requirements. Define package technology from conceptual phase with tradeoffs between product electrical performance (SI/PI), cost quality, reliability and manufacturability. Work on package reliability (1st and 2nd level interconnect) requirements, manufacturability, failure analysis and thermal/mechanical stress interactions. Utilize knowledge of Flip Chip Packaging (bumping process, substrate manufacturing, Assembly manufacturing, lid & stiffener manufacturing process).
Multiple openings. Qualified applicants click **“APPLY NOW” **button to apply online.
Travel required: NO
Qualifications: Degree required
Master’s degree or foreign equivalent in Mechanical Engineering, Computer Engineering, Electrical Engineering, or related field.
Qualifications: Amount and type of experience required: None.
Specific skills required: The following skills are required:
Position requires experience in the following:
-Flip Chip Packaging;
-Operational experience in bumping process, substrate manufacturing, Assembly manufacturing, and lid and stiffener manufacturing process;
-Development work leading to volume production in Semiconductor manufacturing;
-JMP and minitab tools;
-Failure analysis;
-Package reliability; and
-Industry standard (ESD, Jedec, Automotive).
Experience may be gained through graduate-level coursework, research, internship, and/or work experience.
Preferred Skills: N/A
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_Benefits offered are described: _AMD benefits at a glance.
AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.
AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.
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This posting is for an existing vacancy.