Package Assembly Integration Engineer

Intel Intel · Semiconductors · Arizona, Phoenix, United States

This role drives systems development, business processes, and tactical execution for EMIB package assembly and CH factories. It involves feasibility studies, FMEA, integrated process solutions, material/equipment selection, process characterization, new product qualification, technology transfers, and leveraging big data analysis to identify and solve process/tool issues. Collaboration with suppliers and development teams is key to meeting technology roadmaps.

What you'd actually do

  1. Drive systems development, business processes, and tactical execution for EMIB-T OR and CH factories
  2. Job role includes but not limited to feasibility and FMEA studies to drive integrated process solutions to meet desired safety, quality, reliability and output requirements for ultimate transfer to high volume manufacturing.
  3. Selects and develops material and equipment for the process to meet quality, reliability, cost, yield, productivity and manufacturability requirements.
  4. Plans and conducts experiments to fully characterize the process throughout the development cycle and to improve performance for each specific product.
  5. Identifies integrated process solutions to resolve issues or specific requests from customers by partnering with innovators in product engineering and module engineering teams.

Skills

Required

  • Bachelors Degree in natural science or engineering discipline or related STEM field with 5+ years of Industry experience
  • Masters Degree in natural science or engineering discipline or related STEM field with 3+ years of Industry experience
  • EMIB package assembly
  • substrate design
  • manufacturing

Nice to have

  • Extensive knowledge of package assembly and packaging technology/process flows
  • Previous related work experience in a semiconductor foundry

What the JD emphasized

  • EMIB package assembly
  • substrate design
  • manufacturing