Packaging Module Development Engineer

Intel Intel · Semiconductors · Arizona, Phoenix, United States

Develops and optimizes semiconductor packaging assembly processes and equipment for next-generation technologies, focusing on quality, reliability, and manufacturability.

What you'd actually do

  1. Design and develop assembly processes and equipment to enable future packaging technologies.
  2. Optimize manufacturing processes to meet quality, reliability, cost, yield, productivity, and manufacturability requirements.
  3. Create and maintain specifications for processes and equipment using Design of Experiments (DOE) and data analysis principles.
  4. Conduct tests under simulated field conditions, including heat, humidity, temperature cycling, and dynamic forces, to evaluate silicon and packaging technologies.
  5. Oversee the manufacturability of package designs and manage their manufacturing cycles.

Skills

Required

  • Bachelor's degree in Mechanical Engineering, Materials Science Engineering, Chemical Engineering, Electrical Engineering, or a related field with 1+ years of relevant experience or Master's degree in Mechanical Engineering, Materials Science Engineering, Chemical Engineering, Electrical Engineering, or a related field.
  • Familiarity with equipment adjustment, process characterization, and manufacturability or electronics assembly.

Nice to have

  • Proficiency in Statistical Process Control (SPC) and Design of Experiments (DOE) principles.
  • Hands-on experience in a technology manufacturing environment or semiconductor packaging processes.
  • Demonstrated ability to collaborate with cross-functional teams and contribute to time-sensitive projects.