Packaging Module Development Engineer

Intel Intel · Semiconductors · Arizona, Phoenix, United States

Develops and optimizes processes and equipment for Intel's advanced packaging platform technologies, focusing on manufacturability, reliability, quality, cost, yield, and productivity. Collaborates with cross-functional teams to solve engineering challenges and design processes.

What you'd actually do

  1. Develop and optimize panel-level processes and equipment to enable Intel's advanced packaging technologies.
  2. Characterize process windows using principles of design of experiments (DOE) and analyze interactions among equipment, materials, and processes.
  3. Establish equipment configurations, process specifications, and workflows for new technologies, integrating them into production.
  4. Drive continuous improvements in process capability, quality, reliability, cost, and yield while enhancing automation and productivity.
  5. Develop and maintain equipment capable of testing silicon and package technologies under simulated field conditions including heat, humidity, temperature cycling, and dynamic forces.

Skills

Required

  • MS degree in Mechanical Engineering, Chemical Engineering, Manufacturing or Process Engineering, Materials Science, Physics, Chemistry, or a closely related field and 4+ Years Relevant Experience OR PHD degree in Mechanical Engineering, Chemical Engineering, Manufacturing or Process Engineering, Materials Science, Physics, Chemistry, or a closely related field and 2+ Years Relevant Experience
  • Experience in electrochemistry, electrolytic and/or electroless processes.

Nice to have

  • Process development, equipment adjustment, and manufacturing process control.
  • Design of experiments (DOE) principles and statistical data analysis.
  • Process characterization and statistical process control.
  • Materials testing and characterization techniques such as DSC, TGA, D/TMA, ICPMS, FTIR, or SEM.
  • Analytical skills and experience troubleshooting integrated technology issues.
  • Statistical tools, process control frameworks, and Microsoft Office software suite applications.
  • Experience working with organic and inorganic materials in packaging processes.

What the JD emphasized

  • critical role
  • future assembly packaging platform technologies
  • next-generation products
  • advanced IC packaging solutions
  • innovative methods
  • complex engineering challenges
  • design processes
  • shape the future of packaging technology
  • process development
  • equipment adjustment
  • manufacturing process control
  • process characterization
  • statistical process control
  • materials testing
  • troubleshooting integrated technology issues
  • packaging processes