Packaging Module Development Engineer

Intel Intel · Semiconductors · Arizona, Phoenix, United States

Develops and supports advanced assembly processes and equipment for next-generation substrate packaging technologies, applying statistical analysis and data-driven methodologies to improve quality, reliability, process capability, manufacturing efficiency, and cost. Troubleshoots packaging and manufacturing issues using engineering principles and analytical problem-solving techniques.

What you'd actually do

  1. Develop and support advanced assembly processes and equipment for next-generation substrate packaging technologies.
  2. Plan and execute Design of Experiments (DOEs) to support process optimization and evaluate process, material, and equipment interactions.
  3. Apply statistical analysis and data-driven methodologies to improve quality, reliability, process capability, manufacturing efficiency, and cost.
  4. Partner with Procurement and Supplier Quality teams to establish material specifications and support supplier performance and material quality.
  5. Contribute to process improvements through continuous improvement methodologies and engineering best practices.

Skills

Required

  • Knowledge of manufacturing process control and equipment adjustment

Nice to have

  • Design of Experiments (DOE) principles
  • statistical data analysis
  • Statistical Process Control (SPC)
  • JMP
  • Python
  • troubleshooting engineering or manufacturing processes
  • organic and inorganic materials
  • characterization techniques such as DSC, TGA, FTIR, XPS, SEM
  • machine learning techniques
  • relational databases for data analysis and modeling