Phy- V Lead

AMD AMD · Semiconductors · Hyderabad, India · Engineering

This role is for a PHY-V Lead at AMD, responsible for physical verification sign-off, full-chip integration, and packaging interface planning for advanced SoC programs. The lead will drive DRC/LVS clean tapeouts, integration quality, and sign-off predictability, requiring expertise in physical verification, top-level integration, and advanced packaging alignment. The role involves leading cross-functional execution across PD, Analog, and Packaging teams, with a focus on quality, manufacturability, and schedule predictability in high-pressure tapeout environments.

What you'd actually do

  1. Drive end-to-end DRC, LVS, ERC, antenna closure at block and full-chip level
  2. Lead top-level integration of IPs/macros into SoC
  3. Drive RDL planning and bump mapping strategy
  4. Own sign-off checklist, closure tracking, and tapeout readiness
  5. Lead debug of

Skills

Required

  • B.Tech / M.Tech in Electronics / Electrical Engineering
  • 10–15+ years in Physical Design / Physical Verification / SoC Integration
  • Expertise in physical verification tools (e.g., Calibre, ICV, Pegasus)
  • Understanding of SoC architecture and integration flows
  • Knowledge of advanced packaging technologies (e.g., RDL, flip-chip, 2.5D/3D)
  • Familiarity with foundry design rules and sign-off criteria

Nice to have

  • Experience in scripting (TCL/Python) for automation
  • Exposure to SI/PI analysis
  • Experience with emulation or prototyping

What the JD emphasized

  • physical verification sign-off
  • full-chip integration
  • packaging interface (RDL) planning
  • DRC/LVS clean tapeouts
  • integration quality
  • sign-off predictability
  • physical verification
  • top-level integration
  • advanced packaging alignment
  • sign-off closure
  • high-pressure tapeout environments
  • DRC, LVS, ERC, antenna closure
  • sign-off methodology
  • sign-off clean GDS for tapeout
  • top-level integration of IPs/macros into SoC
  • RDL planning
  • bump mapping strategy
  • die–package interface
  • flip-chip / 2.5D / 3D integration readiness
  • sign-off checklist
  • closure tracking
  • tapeout readiness
  • tapeout reviews
  • milestone tracking
  • schedule and quality targets
  • physical verification flows (Calibre/ICV/Pegasus)
  • hierarchical and incremental sign-off
  • risk-managed sign-off
  • primary escalation point for sign-off issues
  • Physical Design / Physical Verification / SoC Integration
  • foundry rule decks
  • waivers
  • risk assessments
  • internal and third-party IPs
  • Packaging, SI/PI, and system teams
  • IO escape routing
  • PD/layout teams