Power Electronics Research Engineer

Ford Ford · Auto · Dearborn, MI +1 · Research and Advance Engineering

Research Engineer focused on power electronics, silicon strategy for automotive inverters, and custom silicon/SiP solutions. Involves analysis, simulation, and measurement of high-frequency signals, with a focus on optimizing power density, efficiency, and EMI performance.

What you'd actually do

  1. Lead the definition of long-term technology roadmaps for Power Management ICs (PMIC) and Application Specific Integrated Circuits (ASIC), specifically tailored for traction inverters and gate drive applications.
  2. Define technical specifications and architectural requirements for custom SoC and ASIC solutions, focusing on the integration of sensing, protection, and control functions into mixed-signal silicon.
  3. Drive the transition from discrete components to SiP solutions to minimize parasitic inductance and optimize the commutation loop for Wide Bandgap (SiC/GaN) devices.
  4. Design power electronic converters for electrified vehicles, integrating advanced filtering solutions with power modules, busbars, and PCBs.
  5. Identify topology and design Common Mode (CM) and Differential Mode (DM) inductive chokes and decoupling capacitors.

Skills

Required

  • Power electronics
  • mixed-signal IC design
  • semiconductor packaging
  • architectural design of power electronic systems
  • PMIC/ASIC design
  • analog/mixed-signal IC specifications
  • automotive applications
  • high-power applications
  • circuit parameter extraction
  • transfer functions from CAD models
  • Double Pulse Test (DPT)
  • semiconductor switching noise
  • noise propagation paths
  • filter design
  • choke design
  • snubber design
  • noise attenuation
  • high-speed time-domain signal acquisition
  • frequency-domain signal acquisition
  • oscilloscopes
  • network analyzers
  • spectrum analyzers
  • PCB design
  • PCB layout
  • high-power filter designs

Nice to have

  • Ph.D. in Electrical Engineering
  • SoC trends
  • SiP trends
  • 2.5D/3D packaging
  • thermal performance
  • electrical performance
  • BCD process technologies
  • high-voltage gate driver design
  • transceiver design
  • semiconductor manufacturing flow
  • fab
  • assembly
  • test
  • IC design cycles
  • RTL to GDSII flow awareness
  • ISO 26262 functional safety requirements
  • ASIL ratings
  • MATLAB
  • PLECS
  • Simplorer
  • SPICE
  • Fusion 360
  • Altium
  • KiCAD
  • EDA tools
  • Cadence
  • Mentor Graphics
  • Synopsys
  • FPGA prototyping
  • Siemens IC portfolio
  • automotive requirements
  • AEC-Q100 qualification standards
  • high-voltage systems
  • high-temperature circuit design
  • power semiconductor packaging
  • material purchasing
  • capital purchasing
  • project management tools
  • silicon development lifecycles

What the JD emphasized

  • Master’s degree in Electrical Engineering with a focus on power electronics, mixed-signal IC design, or semiconductor packaging.
  • 3+ years of research or industry experience in: Architectural design of power electronic systems or PMIC/ASIC design.
  • Developing specifications for analog/mixed-signal ICs in automotive or high-power applications.