Principal Foundry Technologist

Microsoft Microsoft · Big Tech · Redmond, WA +4 · Silicon Engineering

This role focuses on semiconductor process development and manufacturing for Microsoft's cloud hardware, including custom chips like Azure Cobalt. The Principal Foundry Technologist will lead technical interactions with external foundries, analyze data for yield and performance optimization, and contribute to the design and characterization of testchips. The role requires deep understanding of semiconductor physics, manufacturing processes, and statistical analysis to ensure high-quality, cost-effective silicon production for Microsoft's cloud infrastructure.

What you'd actually do

  1. Lead technical interactions with external foundries both in pre-silicon design and post silicon development as well as continuous improvement for yield and performance during manufacturing stage to ensure Best-in-class Microsoft first-party and second-party silicon.
  2. Compile and analyze data using common statistical techniques and effectively present key results along with recommended actions; practice continuous improvement and yield optimization and analyze products to ensure manufacturability and data sheet compliance
  3. Understand architecture and system requirements and provide sound technical assessment
  4. Define and design engineering structure in testchip for technology interception and enablement including data collection, analysis and model-silicon characterization.
  5. Provide comprehensive Power, Performance, Area and Cost analysis for technology enablement.

Skills

Required

  • Doctorate in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 3+ years technical engineering experience OR Master's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 6+ years technical engineering experience OR Bachelor's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 8+ years technical engineering experience OR equivalent experience
  • Ability to meet Microsoft, customer and/or government security screening requirements
  • Microsoft Cloud Background Check
  • Access to export-controlled information

Nice to have

  • 8 + years of experience in semiconductor process development and manufacturing.
  • 5+ years of experience in technology evaluation, testchip and modeling
  • Deep understanding of device physics, foundry design collateral management, process qualification, broad fabrication process experience, device reliability, statistical analysis, yield improvement, and physical failure analysis techniques
  • Experience in supporting design teams with PDKs, IP development, tapeout, establishing DFM and design for reliability requirements and implementation of test structures for test chips
  • Product yield/performance analysis, and design process co-optimization.
  • Familiarity with device-level measurements and associated test equipment, data analysis, modeling, simulation, targeting and projection
  • Model based problem solving skills through data analysis and understanding of SOC design features, fab process interactions and test methodology.
  • Knowledge of EDA tools from Cadence, Caliber, Synopsys, Siemens for device and IP study.
  • Experience in leading cross functional teams and program/project management.
  • Probability and statistics background including DOE’s.
  • Experience in product and test engineering, and ATE test program methodologies
  • Knowledge in digital design floor planning, STA; taking RTL to GDS and optimize for PPA
  • Some experience in coding using various languages including but not lim

What the JD emphasized

  • Best-in-class Microsoft first-party and second-party silicon
  • yield and performance during manufacturing stage
  • continuous improvement and yield optimization
  • data collection, analysis and model-silicon characterization
  • Power, Performance, Area and Cost analysis