Principal Mechanical Engineer (onsite)

RTX RTX · Aerospace · el segundo, CA +1 · Engineering

Principal Mechanical Engineer role at RTX (Collins Aerospace) focused on leading the mechanical development of GPS RF and digital electronics subsystems from concept through production. Requires a STEM degree, 8+ years of experience, and an active security clearance. Responsibilities include technical authority, subsystem ownership, cross-functional collaboration, and mentoring junior engineers. Experience with electronics packaging, GD&T, 3D modeling, and environmental qualifications is required.

What you'd actually do

  1. Lead the mechanical development of GPS RF and digital electronics subsystems from concept through production.
  2. Serve as the mechanical technical authority (REA) on assigned programs, ensuring alignment to technical, cost, and schedule objectives.
  3. Own subsystem-level mechanical solutions, ensuring performance in demanding thermal and high-vibration environments.
  4. Collaborate cross-functionally with Electrical, Systems, Manufacturing, and Supply Chain teams to deliver integrated hardware solutions.
  5. Represent the mechanical discipline in internal and external design reviews and customer engagements.

Skills

Required

  • STEM degree and 8 years of experience or advanced degree and 5 years of experience
  • Ability to obtain and maintain a U.S. government issued security clearance
  • U.S. citizenship
  • Experience designing and developing electronics packaging solutions for high-reliability GPS Receivers or related military applications
  • Experience applying Geometric Dimension Tolerance (GD&T) and American Society of Mechanical Engineers (ASME) drawing standards to production hardware
  • Experience with 3D solid modeling tools (Creo/Pro/Engineer or similar) for mechanical design and documentation
  • Experience supporting hardware through environmental qualifications (e.g., vibration, shock, thermal)

Nice to have

  • Experience with airborne or space electronics, CCA or unit
  • Experience serving as a subsystem lead, REA, or similar technical authority role
  • Experience with thermal and structural analysis methods for electronics hardware
  • Experience with CCA/PCB integration, cabling and harness design, or RF isolation features
  • Experience supporting design reviews (PDR, CDR, TRR) and presenting technical data to customers
  • Experience performing root cause investigations and implementing corrective actions in production environments

What the JD emphasized

  • The ability to obtain and maintain a U.S. government issued security clearance is required.
  • U.S. citizenship is required
  • Experience designing and developing electronics packaging solutions for high-reliability GPS Receivers or related military applications.