Principal/senior Principal Electronics Durability Engineer

Northrop Grumman Northrop Grumman · Aerospace · Baltimore, MD +1 · Mechanical

Northrop Grumman is seeking a Principal or Senior Principal Electronics Durability Engineer to perform and lead durability analysis for Mission Systems platforms across various applications (airborne, ground mobile, ground stationary, surface naval). The role involves thermal or structural analysis, fatigue-driven design, and providing mitigation plans, with a focus on mentoring junior engineers and presenting technical results to customers. Requires experience with CAE software and durability analysis methods for electronic and avionics systems.

What you'd actually do

  1. Perform electronics durability analysis, requiring experience in thermal or structural analysis and expertise in fatigue driven design for Mission Systems platforms such as airborne, ground based, and naval applications
  2. Lead durability analysis efforts by owning requirements, proactively obtaining multidisciplinary analysis inputs, and providing programs with robust fatigue mitigation plans, while mentoring engineers less experienced in durability analysis
  3. Provide oral and written presentations and reports to internal and external customers and stakeholders

Skills

Required

  • Bachelor's Degree with 5 years of experience, Master's Degree with 3 years of experience, Ph.D. with 1 years of experience in Science, Technology, Engineering, Mathematics or related technical fields (Principal)
  • Bachelor's Degree with 8 years of experience, Master's Degree with 6 years of experience, Ph.D. with 4 years of experience in Science, Technology, Engineering, Mathematics or related technical fields (Senior Principal)
  • U.S. citizenship
  • Ability to obtain and maintain a DoD Secret security clearance
  • Ability to work onsite at the Linthicum, MD / Baltimore facility on a daily basis
  • Professional experience in electronics design
  • solder joint durability analysis for products operating in varied and demanding environments
  • performing design-by-analysis using a Computer-Aided Engineering (CAE) software package (e.g., ABAQUS, ANSYS, NASTRAN, or similar)
  • applying durability analysis methods (e.g., fatigue life prediction, damage accumulation, strain-life or stress-life approaches) to fatigue issues in advanced electronic and avionics systems
  • developing and implementing component-level design changes or mitigations (e.g., geometry changes, material selection, mounting strategies) to address durability life limitations
  • presenting technical results to internal and/or external program stakeholders
  • preparing written technical reports as contractual deliverables
  • leading engineering teams, including assigning tasks, mentoring team members, and reviewing technical work to achieve hardware design milestones
  • Experience managing multiple concurrent deadlines and coordinating technical inputs/data from multiple functional teams

What the JD emphasized

  • DoD Secret Clearance
  • electronics design
  • solder joint durability analysis
  • thermal, vibration, and mechanical loading conditions
  • design-by-analysis
  • Computer-Aided Engineering (CAE) software package
  • durability analysis methods
  • fatigue life prediction
  • damage accumulation
  • strain-life or stress-life approaches
  • fatigue issues
  • advanced electronic and avionics systems
  • component-level design changes or mitigations
  • geometry changes
  • material selection
  • mounting strategies
  • durability life limitations
  • presenting technical results
  • internal and/or external program stakeholders
  • preparing written technical reports
  • contractual deliverables
  • leading engineering teams
  • assigning tasks
  • mentoring team members
  • reviewing technical work
  • hardware design milestones
  • managing multiple concurrent deadlines
  • coordinating technical inputs/data
  • multiple functional teams