Process Integration Development Engineer

Intel Intel · Semiconductors · Oregon, Hillsboro, United States

This role involves characterizing semiconductor nano-devices using advanced transmission electron microscopy (TEM) to support technology development, process development, and process integration. The engineer will perform imaging and analysis using TEM, EELS, EDX, and 4D STEM, with a focus on improving time-to-information-return for critical manufacturing processes.

What you'd actually do

  1. Technical functions in support of engineering activities such as fabrication, failure analysis, technology development, process development, and process integration.
  2. Collaborates with engineering teams to optimize metrology strategies and troubleshoot process flow issues.
  3. Conducts engineering tasks and detailed technical procedures to perform sample preparation or imaging using advanced focused-ion-beam and/or transmission electron microscope tools in support of the research and development activities of Intel.
  4. Contributes to continuous improvement efforts in high volume manufacturing environments.
  5. Performs other related duties as required or directed.

Skills

Required

  • PhD degree in a Technical Area (Materials Science, Chemistry, Physics or related field of study)
  • Hands-on experience with Transmission Electron Microscopy (TEM) operation.

Nice to have

  • Python scripting or MATLAB or other programming languages
  • Hands-on Experience with TEM sample imaging with automation
  • Hands-on Experience with Advanced Transmission Electron Microscopy, such as EELS, EDX and/or 4D STEM
  • Knowledge of semiconductor process integration

What the JD emphasized

  • critical to TD
  • revolutionary changes