Process Integration, Yield and Defect Reduction Engineering Manager

Intel Intel · Semiconductors · New Mexico, Albuquerque, United States

Engineering Manager role focused on process integration, yield improvement, and defect reduction in advanced semiconductor packaging manufacturing. Requires collaboration with various engineering teams to optimize manufacturing performance and develop scalable solutions. Involves leading a team, developing roadmaps, and implementing monitoring systems.

What you'd actually do

  1. Develop and execute a comprehensive defect reduction roadmap to improve yield and product quality.
  2. Design and implement defect scan strategies, quick-turn analyses, and parametric monitoring systems.
  3. Leverage Win It Inline methodologies to drive continuous process improvement while meeting quality and reliability objectives.
  4. Lead a team of process integration, yield, and defect reduction engineers in solving complex manufacturing challenges.
  5. Collaborate with design, materials, product engineering, characterization, process development, and High Volume Manufacturing (HVM) teams to optimize manufacturing performance.

Skills

Required

  • Master's or PhD in Electrical Engineering, Materials Science, Physics, Chemistry, Chemical Engineering, or a related technical discipline.
  • 5+ years of relevant semiconductor manufacturing or advanced packaging experience.
  • Technology development and technology transfer.
  • Solving complex technical problems through innovative engineering approaches.
  • High levels of technical contribution throughout the product development lifecycle.

Nice to have

  • 3+ years of yield analysis and defect reduction methodologies.
  • 3+ years of Failure Mode and Effects Analysis (FMEA).
  • 3+ years developing inline monitoring systems and manufacturing dashboards.
  • Deep understanding of integrated semiconductor process flows and process interactions.
  • Strong knowledge of defect metrology tools and capabilities.

What the JD emphasized

  • strong technical background
  • foundry customer commitments
  • high-volume manufacturing
  • advanced packaging technologies
  • critical process modules
  • technical problem solving
  • technology transfer
  • product development lifecycle