Senior Chip Assembly Manufacturing Development Engineer

NVIDIA NVIDIA · Semiconductors · Hsinchu, Taiwan

NVIDIA is seeking a Senior Chip Assembly Manufacturing Development Engineer to bring new products and technologies to high volume manufacturing, identify and resolve quality/yield issues, and drive continuous improvement in manufacturing. The role requires extensive experience in semiconductor packaging, process development, and supplier management, with strong statistical analysis and quality control skills.

What you'd actually do

  1. Bring new products and new technologies to high volume manufacturing
  2. Identify chip assembly interactions and implement solutions to resolve quality/yield issues
  3. Drive continuous improvement in manufacturing yield, cycle time and product quality/reliability
  4. Address manufacturing execution and quality issues through systemic solutions
  5. Deliver datamation solutions for enhanced decision making

Skills

Required

  • Master’s degree or higher in Engineering or Science with emphasis on Mechanical, Materials Science, Chemical Engineering fields (or equivalent experience)
  • 12+ year validated experience in Flip Chip semiconductor packaging design, process and materials development
  • Direct experience in advanced assembly technologies such as 2.5D/3D packaging
  • Thorough understanding of chip assembly equipment design
  • Knowledge of materials, process, substrate/package design in chip assembly operations
  • Extensive project management experience
  • OSAT management experience
  • Strong statistical analysis skills
  • Deep understanding of quality control, statistics process control, gage R&R and DOE techniques
  • Knowledge of packaging industry and its supply chain
  • Excellent written and oral communication skills

Nice to have

  • Photonics packaging experience
  • Experience with PCB assembly

What the JD emphasized

  • 12+ year validated experience in Flip Chip semiconductor packaging design, process and materials development
  • Direct experience in advanced assembly technologies such as 2.5D/3D packaging is essential