Cerebras Systems builds the world's largest AI chip, 56 times larger than GPUs. Our novel wafer-scale architecture provides the AI compute power of dozens of GPUs on a single chip, with the programming simplicity of a single device. This approach allows Cerebras to deliver industry-leading training and inference speeds and empowers machine learning users to effortlessly run large-scale ML applications, without the hassle of managing hundreds of GPUs or TPUs.
Cerebras' current customers include top model labs, global enterprises, and cutting-edge AI-native startups. OpenAI recently announced a multi-year partnership with Cerebras, to deploy 750 megawatts of scale, transforming key workloads with ultra high-speed inference.
Thanks to the groundbreaking wafer-scale architecture, Cerebras Inference offers the fastest Generative AI inference solution in the world, over 10 times faster than GPU-based hyperscale cloud inference services. This order of magnitude increase in speed is transforming the user experience of AI applications, unlocking real-time iteration and increasing intelligence via additional agentic computation.
Senior IC Design Engineer – IO Signal Integrity & Power Delivery
About the Role
In this role, you’ll be at the center of high-speed IO interface design and integration, driving the signal integrity (SI) and power delivery (PI) performance of custom IP within our wafer-scale engine.
This position emphasizes complete system analysis, architecture, integration and circuit design from transistor level to external voltage regulator, to ensure that custom and third-party IP meets performance, power, and reliability targets across die, 3d assembly, and system level boundaries.
You’ll collaborate closely with design, packaging, and system engineers to architect and validate custom DDR-like interfaces, IO circuits, and power delivery networks. This is a hands-on technical leadership role for an engineer who understands how circuit behavior, interconnect design, and system integration combine to define product success.
Key Responsibilities
Own IO signal integrity and power delivery analysis for custom and third-party IP integration in full system stack: die level, 3d integration, board level
Define interface architecture and design specifications, including signaling schemes, impedance targets, and power distribution requirements.
Perform and review channel modeling, IBIS-AMI/SPICE simulations, and system-level SI/PI analysis to ensure timing and margin robustness.
Collaborate with internal and external IP providers to evaluate, select, and integrate custom IO and PHY solutions.
Lead power delivery network (PDN) modeling and IR-drop analysis, driving improvements across chip, package, and board.
Support silicon bring-up, validation, and correlation of simulation results to lab measurements.
Provide technical direction on ESD design, IO reliability, and aging (NBTI, PBTI, HCI).
Partner with architecture, physical design, and system teams to optimize signal quality, timing closure, and power efficiency.
Develop and maintain internal simulation flows, modeling scripts, and automation tools in Tcl/Python.
**Skills & Qualifications **
10+ years of experience in IC or IO design, analysis, or integration.
Deep understanding of signal integrity, power integrity, and high-speed interface design (DDR, LPDDR, HBM, or similar).
Experience with 3d or 2.5d integration, interposers, die stacking
Strong knowledge of FinFET CMOS technology and transistor-level device behavior.
Expert with HSPICE, FineSim, or equivalent circuit and transient simulation tools.
Experience with channel and package modeling, S-parameter extraction, and time/frequency-domain analysis.
Proficient in IR-drop analysis, PDN optimization, and decoupling network design.
Solid understanding of IO and ESD circuit fundamentals, including protection and clamp strategies.
Experience running aging and reliability simulations and applying results to design optimization.
Strong scripting and automation experience in Tcl, Python, or similar.
Excellent problem-solving, analytical, and cross-functional collaboration skills.
B.S. or M.S. in Electrical Engineering or equivalent required (Ph.D. preferred).
The base salary range for this position is $200,000 to $275,000 annually. Actual compensation may include bonus and equity, and will be determined based on factors such as experience, skills, and qualifications.
Why Join Cerebras
People who are serious about software make their own hardware. At Cerebras we have built a breakthrough architecture that is unlocking new opportunities for the AI industry. With dozens of model releases and rapid growth, we’ve reached an inflection point in our business. Members of our team tell us there are five main reasons they joined Cerebras:
- Build a breakthrough AI platform beyond the constraints of the GPU.
- Publish and open source their cutting-edge AI research.
- Work on one of the fastest AI supercomputers in the world.
- Enjoy job stability with startup vitality.
- Our simple, non-corporate work culture that respects individual beliefs.
Read our blog: Five Reasons to Join Cerebras in 2026.
Apply today and become part of the forefront of groundbreaking advancements in AI!
_Cerebras Systems is committed to creating an equal and diverse environment and is proud to be an equal opportunity employer. __We celebrate different backgrounds, perspectives, and skills. We believe inclusive teams build better products and companies. _We try every day to build a work environment that empowers people to do their best work through continuous learning, growth and support of those around them.
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