Overview
At Microsoft Research, we are shaping the future of AI infrastructure by pursuing high-risk and high-reward programs that will define the next generation of AI platforms. Our work spans the full stack, models, systems, software, and hardware, and we partner with product teams across Microsoft to turn research breakthroughs into impact at scale. Through close collaboration with industry partners, the team bridges research and production, translating hardware innovation into working prototypes and manufacturable solutions for next-generation AI infrastructure. You will join a multidisciplinary team working at the intersection of optics, electronics, photonics, packaging, networking, and AI system design.
We are seeking an Optical Packaging Engineer with deep expertise in co-packaged optics and advanced packaging technologies. The successful candidate will play a critical role in bridging photonic devices, electronic ICs, and system-level integration through scalable, manufacturable packaging solutions. You will work closely with both Microsoft R&D teams and Azure engineering teams to bring innovations from prototype to production.
This role offers a unique opportunity to work hands-on with cutting-edge technologies while collaborating with world-class researchers, internal product teams, and Tier-1 partners to translate research into deployable systems.
Microsoft’s mission is to empower every person and every organization on the planet to achieve more. As employees we come together with a growth mindset, innovate to empower others, and collaborate to realize our shared goals. Each day we build on our values of respect, integrity, and accountability to create a culture of inclusion where everyone can thrive at work and beyond.
Microsoft is an equal opportunity employer. We celebrate diversity and are committed to creating an inclusive environment for all employees.
Responsibilities
CPO Architecture & Packaging Co-Design
- Design and development of packaging architectures for co-packaged optics, including integration of photonic devices, ASICs, and interposers.
Advanced Packaging Development
- Define and prototype packaging solutions leveraging technologies such as 2.5D/3D integration (e.g., FOWL, CoWoS, EMIB, SOIC/HB etc), fiber attach, optical coupling, and thermal management.
Optical Assembly & Alignment Strategy
- Develop scalable optical assembly processes, including alignment tolerances, passive/active alignment strategies, and manufacturability trade-offs.
Cross-Disciplinary Co-Design
- Work closely with photonics, electronics, and system teams to co-optimize packaging, signal integrity, power delivery, and thermal performance.
Partner Engagement & Technology Transfer
- Collaborate with Tier-1 suppliers and ecosystem partners to realize packaging solutions and drive technology towards production readiness.
Prototyping, Validation & Iteration
- Build and evaluate prototypes, identify key failure modes, and iterate designs based on measurement data and system-level constraints.
Qualifications
Required/Minimum Qualifications
Master’s or PhD’s degree in Electrical Engineering, Photonics, Materials Science, or a related field.
Proven industry experience in wafer/panel level and advanced packaging with a strong focus on optical packaging, Co-packaged optics (CPO) or closely related technologies.
Hands-on experience with:
- Optical module or CPO packaging design
- Fiber attach / optical coupling techniques
- High-speed interconnect packaging and signal integrity considerations
Strong understanding of system-level trade-offs (electrical, optical, thermal, mechanical).
Ability to operate effectively in a multi-disciplinary environment.
Excellent communication skills in English, both written and spoken, including the skill to clearly communicate technical results and justify assumptions to diverse technical audiences.
Additional or Preferred Qualifications
Experience in advanced semiconductor packaging (e.g., FCBGA, 2.5D/3D integration).
Familiarity with hyperscale data center interconnect requirements.
Experience working with external manufacturing partners or Tier-1 suppliers.
Track record of delivering packaging solutions from concept to prototype or production.
Background aligned with leading CPO practitioners (e.g., industry or research experience similar to co-packaged optics leaders).
Research Sciences IC4 - The typical base pay range for this role across United Kingdom is £ 74,700.00 - £ 112,100.00 per year. Certain roles may be eligible for benefits and other compensation.
Find additional benefits and pay information here: https://careers.microsoft.com/v2/global/en/corporate-pay/united-kingdom-corporate-pay.html
This position will be open for a minimum of 5 days, with applications accepted on an ongoing basis until the position is filled.
Microsoft is an equal opportunity employer. All qualified applicants will receive consideration for employment without regard to age, ancestry, citizenship, color, family or medical care leave, gender identity or expression, genetic information, immigration status, marital status, medical condition, national origin, physical or mental disability, political affiliation, protected veteran or military status, race, ethnicity, religion, sex (including pregnancy), sexual orientation, or any other characteristic protected by applicable local laws, regulations and ordinances. If you need assistance with religious accommodations and/or a reasonable accommodation due to a disability during the application process, read more about **requesting accommodations.**