Senior Osat Manufacturing Development Engineer

NVIDIA NVIDIA · Semiconductors · Hsinchu, Taiwan

NVIDIA is seeking a Senior OSAT Manufacturing Development Engineer to drive new products and technologies into high volume manufacturing, focusing on continuous improvement in yield, cycle time, and product quality/reliability. The role involves addressing manufacturing issues, delivering datamation solutions, managing supplier performance, and leading change control and material disposition. Requires a Master's degree or equivalent experience in Engineering or Science, 5+ years in Flip Chip semiconductor packaging, and strong statistical analysis skills.

What you'd actually do

  1. Bring new products and new technologies to high volume manufacturing
  2. Drive continuous improvement in manufacturing yield, cycle time and product quality/reliability
  3. Address manufacturing execution and quality issues through systemic solutions
  4. Deliver datamation solutions for enhanced decision making
  5. Manage supplier performance evaluation matrix and keep it updated based on changing business needs

Skills

Required

  • Master's degree or higher in Engineering or Science with emphasis on Mechanical, Materials Science, Chemical Engineering fields (or equivalent experience)
  • 5+ year validated experience in Flip Chip semiconductor packaging design, process and materials development
  • Direct experience in advanced assembly technologies such as 2.5D/3D packaging
  • Thorough understanding of chip assembly equipment design
  • Extensive project management and OSAT management experience
  • Strong statistical analysis skills
  • Deep understanding of quality control, statistics process control, gage R&R and DOE techniques
  • Knowledge of packaging industry and its supply chain
  • Excellent written and oral communication skills

Nice to have

  • Photonics packaging experience

What the JD emphasized

  • Flip Chip semiconductor packaging design, process and materials development
  • advanced assembly technologies such as 2.5D/3D packaging is essential