Senior Package Engineer

NVIDIA NVIDIA · Semiconductors · Hsinchu, Taiwan +2 · Remote

Senior Package Engineer at NVIDIA responsible for leading the development of microelectronics packaging for future products, collaborating with vendors, and supporting production. Requires MSc or equivalent experience in Mechanical/Materials Engineering with at least 5 years of experience in complex process development.

What you'd actually do

  1. Leading the development of groundbreaking microelectronics packaging for Nvidia Networking Business Unit's future products
  2. Collaborating with world-leading vendors to develop highly ambitious packaging solutions
  3. Joining and leading task forces to investigate and support production excursions, failure analysis, and reliability issues
  4. Failure investigations and production support for High volume products

Skills

Required

  • MSc or equivalent experience in Mechanical Engineering / Materials Engineering or similar
  • At least 5 years of experience with development of complex processes (warpage, heat, optics, Adhesives, etc).
  • Experience co-working with subcontractors and vendors
  • Vision and focus for projects and team
  • Curious and creative problem solver as well as organized and multi-tasker
  • Team oriented, able to move and motivate peers. Strong interpersonal skills (verbal and written)
  • High awareness of quality, manufacturability and project schedule

Nice to have

  • Proven record in packaging development
  • Background in semiconductor manufacturing processes and optical systems