Senior Package Layout Engineer - Hardware

NVIDIA NVIDIA · Semiconductors · Santa Clara, CA +5 · Remote

Senior Package Layout Engineer at NVIDIA focusing on the design and development of IC substrates for NVIDIA products, collaborating with design teams on schedules, costs, manufacturing, and electrical design issues.

What you'd actually do

  1. As part of a Layout team, you will collaborate to implement high speed/density ASIC packages.
  2. Perform substrate breakout patterns for ASIC packages.
  3. Optimize package pinout incorporating system level trade-offs of pins assignment.
  4. Help perform package routing, placement, stack-up, reference plane and power distribution using Cadence APD or SiP tool suite.
  5. Propose layout design trade-offs to the Technical Package Lead for resolution and implementation.

Skills

Required

  • B.S. Electrical Engineering or equivalent experience
  • 5+ years experience in PCB Layout of graphics cards, motherboards, line cards or other related technology.
  • Proven experience in substrate layout of wire bond and flip chip packages
  • Significant background with Cadence APD or SiP and/or PCB layout tools (including Constraint Manager)
  • Solid understanding of high-speed design signal integrity practices

Nice to have

  • Experience with HDI designs is a plus
  • Experience with Virtuoso and Calibre is a plus
  • Experience using Valor is helpful

What the JD emphasized

  • B.S. Electrical Engineering or equivalent experience
  • 5+ years experience in PCB Layout of graphics cards, motherboards, line cards or other related technology.
  • Proven experience in substrate layout of wire bond and flip chip packages, preferred
  • Significant background with Cadence APD or SiP and/or PCB layout tools (including Constraint Manager)
  • Solid understanding of high-speed design signal integrity practices