Senior Packaging Technical Engineer - Hardware

NVIDIA NVIDIA · Semiconductors · CA · Remote

NVIDIA is seeking a Senior Packaging Technical Engineer to define and implement silicon pad rings, substrate interconnect schemes, and lead the package layout design process. This role involves collaborating with various engineering teams and requires expertise in chip floor planning and package design.

What you'd actually do

  1. Your responsibilities include defining and implementing the chip pad ring, substrate interconnect scheme, and lead the package layout design process.
  2. We collaborate with large teams consisting of Circuit, Signal Integrity, RTL, Place and Route, substrate layout and system design Engineers and Managers.
  3. Work to define a chip floor plan, pad ring, substrate, and ball out implementing a robust world-class electrical package!
  4. Communicate effectively with various teams throughout the company

Skills

Required

  • BSEE or equivalent experience
  • 8+ years in board/system design

Nice to have

  • Experience with package design
  • Understanding of transmission line theory, power delivery and signal integrity
  • Programming and scripting skills in Perl, Python, Tcl
  • Cadence Skill
  • EXCEL familiarity

What the JD emphasized

  • Minimum of 8+ years in board/system design
  • Experience with package design is preferred
  • Good understanding of transmission line theory, power delivery and signal integrity is desired
  • It is preferred to have programming and scripting skills in Perl, Python, Tcl desired, Cadence Skill and EXCEL familiarity are useful and a plus
  • Hardworking and able to work with a minimum of supervision
  • You seek to solve complex technical problems